Optimize Power, Performance and Cost

In the race to deliver low-cost, high-performance, power-efficient electronics and semiconductor products in a timely manner, engineers are adopting chip–package–system (CPS) design methodology that allows co-analysis and co-optimization across the entire system.

CPS Video

Watch the video and see how Chip-Package-System (CPS) is the best methodology to reliably achieve the performance, integration, and cost demands of today's electronics, allowing chip, package, and system engineers to communicate with each other, creating a cohesive design eco-system.

ANSYS products provide a comprehensive solution for 3-D chip design, including FinFET transistors, stacked-die IC and packages. The simulation-driven modeling, analysis and verification workflow enables you to optimize power delivery and timing networks, identify signal integrity and power integrity issues, and mitigate EMI and thermal issues early in the design cycle.