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Smart Home Energy Efficient IoT Technology - Video

“Smart Home” technology is the future of residential technology, designed to deliver and distribute a number of services inside and outside the house via networked devices in which all the different applications and the intelligence behind them are integrated and interconnected. These smart devices have the potential to share information with each other as long as they can access a broadband internet connection. Hence, “Smart Home” technology has become part of the IoT (Internet of Things). In this work, we analyze a home model to demonstrate an energy-efficient IoT-based smart home.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS Electronics Desktop
Product Category: Electronics, Cloud and IT Solutions, Embedded Software
Industry: Consumer Products, High Tech
Sub Industry: Consumer Electronics


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ANSYS in ACTION: Analog and Mixed Signal Workflows for Power and Reliability Signoff for SerDes IP and PMIC - Webinar

Analog and mixed signal IPs are very complex and require significant time to design, verify and validate. With increasing mask costs and tighter design cycles, first time silicon success is key to accelerate time to market and beat the competition. Watch this 20-minute webinar to learn how AMS workflows based on ANSYS Totem, a layout-based transistor level power and reliability signoff platform, can enable you to design the next generation of SerDes IP or PMIC for cutting-edge applications.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Totem
Sub Industry: Semiconductors


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Concept Modeling and Simulation with ANSYS SpaceClaim - Webinar

Watch this webinar to explore ANSYS SpaceClaim's 3-D concept modeling capabilities. We’ll demonstrate the power that direct modeling brings to various workflows, such as design, manufacturing, 3-D printing, reverse engineering, sheet metal fabrication and engineering simulation. You’ll learn how SpaceClaim can be used for rapid concept development starting from a blank screen or imported file; how it creates and edits assemblies; and how rapidly it can make detailed 2-D drawings.

Finally, we’ll demonstrate SpaceClaim technology in the context of an engineering simulation using a new product called ANSYS Discovery Live, a revolutionary solution that rewards you with instantaneous simulation results as soon as you change the geometry or other parameters of your model. Attend this webinar and you’ll walk away more confident in your ability to perform concept modeling and true upfront simulation.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS SpaceClaim


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High Capacity Power Signoff Using Big Data - Webinar

In this webinar, learn how NVIDIA has developed a workflow to run a flat, full-chip power integrity and reliability signoff analysis using a fully distributed compute and big data solution with ANSYS RedHawk-SC. They achieved a turn-around time of well under 24 hours for full-chip flat power signoff analysis on NVIDIA’s largest GPU – Volta, which contains around 21 billion transistors. Additionally, silicon correlation exercises performed on the Volta chip using RedHawk-SC produced simulated voltage values that were within 10 percent of silicon measurement results. This methodology was published in the Design Automation Conference 2017 (DAC 2017) Designer/IP track poster session. Discover how NVIDIA’s most powerful GPU uses ANSYS’ next generation SoC power signoff solution based on big data to deliver the best performance for cutting-edge AI and machine learning applications.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS RedHawk


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ANSYS Discovery Live and Geometry Modeling - Webinar

ANSYS SpaceClaim, which allows you to create and edit virtually any 3-D CAD file, provides the geometry backbone for this application. As fast as you can make changes to models, Discovery Live provides instant engineering simulation answers. This combination empowers true upfront simulation. Join us for this webinar and learn about several ANSYS concept modeling tools along with the power of direct modeling in SpaceClaim. You'll walk away being able to edit models as fast as Discovery Live solves them.

Author: ANSYS Type: Webinar Date:


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如何利用工程仿真优化石油天然气精炼厂经营利润

近年来,石油天然气精炼厂面临着一些高难度的全新挑战。由于最新的环境标准强制要求使用低硫燃料,因而这些挑战包括了由此产生的大量资本开支和更高的氢用量。美国墨西哥湾岸区受飓风破坏引起汽油短缺,使得新闻重点报道了精炼厂因此增大的利润空间。一般来说,这些利润增加体现在每加仑的绝对值上,没有均化在精炼厂必须支付的原油成本上。虽然汽油的价格上升显著,但化工产业所用石油产品的价格仍面临持续的下行压力,因为消费者和经销商能让消费产品的价格保持在低位。因此就业务来说,最大限度地减少计划外的停工,同时保持最低的运营和公用成本是关键所在。

一套新出台的环境法规对精炼厂形成了更为严峻的挑战,要求各工厂减少空气污染物的排放。例如,为了符合相关标准的要求,德克萨斯州为减少休斯敦/加尔维斯顿区域氮氧化物排放制定的州实施计划(SIP)就要求进行成本不菲的设备翻修和升级。

Author: ANSYS Type: White Paper Date:
Product Category: Fluids


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混合有限元边界积分法

随着近期积分方程求解效率的提高,现在我们可以在混合有限元边界积分法(FEBI)中将积分方程法和有限元法相结合(FEM)[1]。在电磁学中,FEM是一种通用技术,该技术既支持体积电场求解,又能精确地描述微波组件、天线和信号完整性问题[2,3]。对于天线或散射问题,必须包含围绕模型的空气域,并且用吸收边界条件(ABC)予以闭合。虽然用于直接求解对象表面电流的积分方程(IE)方法不如FEM通用,但它在解决大型开放问题时往往效率更高,因为它不需要周围的空气体积。通过在FEBI方法中结合这两种方法,HFSS用户能够准确高效地仿真非常复杂的大型开放性问题。HFSS™的13.0版将提供这种新方法。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS


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卓越仿真成就创新型电子设计

我们正处在以电子技术为中心的创新繁荣期,我们的通信、工作、学习和娱乐方式也因为这些创新而改变。技术的创新发展会影响几乎所有的产品。在全球范围内,看得见和看不见的电子应用有很多,其中包括非常智能的手机、光纤和无线网络、可以装在口袋里的计算机、能模拟纸张的LED显示屏以及宠物追踪芯片。进入第二个千禧年后,汽车中配备了各类电子设备,以此来控制发动机功能,防止车轮打滑,避免发生事故,以及指引行驶路线等。航空电子设备包括雷达、电传操纵系统和机载通信。电子技术创新已经应用到了工业和军事领域:智能电子产品正在重新定义一切事物,从准时制生产到国土安全。这些设备对我们的生活质量产生了明显影响。然而,互联产品已经发展到何种程度,又将如何影响我们的安全,这些还有待我们去发现。

Author: ANSYS Type: White Paper Date:
Industry: High Tech
Sub Industry: Electrical and Electronics


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系统感知型SoC的功耗、噪声和可靠性验收

在全球竞争激烈的移动、消费类和汽车电子系统市场中,低功耗、高性能以及高可靠性是至关重要的成功因素。为了应对这些相互冲突的要求,设计团队需要面面俱到地考虑多种方案,例如采用高级工艺技术节点,尤其是基于FinFET的器件。这些高级技术节点让芯片不仅能在更低功耗下以更快的速度运行,同时还可在相同尺寸的硅片中集成更多功能。但是,在这些工艺节点上,由于器件的物理特性、尺寸和形状以及互联等因素,在进行功耗、噪声和可靠性验收时会遇到严重问题。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS RedHawk


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使用计算建模控制和优化结晶工艺

结晶工艺广泛应用于化工、石油化工和制药行业。在化学工业中,碳酸钾和腐蚀剂行业将结晶用作生产大宗化学品的方式以及提纯的分离技术。精细化工和专业化工行业会使用结晶工艺生产各种高价值的有机化合物。在药品制造中,结晶工艺常用于制造活性药物中间体(API)。尽管用途广泛,但从科学的角度来说,结晶工艺并未得到充分的了解。许多工艺参数彼此耦合,很难单独地进行研究或分析。在大规模结晶工艺中,非理想混合的流体动力学问题变得至关重要。成核和生长的动力学会影响最终的晶体形状和大小。此外,过饱和度比例和剖面也同样会影响晶体的形状和大小。鉴于巨大的复杂性,单独研究不同成分并逐渐耦合现象的方法仍然非常实用。本文旨在介绍结晶器工艺控制和扩大过程中面临的部分流体动力学挑战。

Author: ANSYS Type: White Paper Date:
Product Category: Fluids
Industry: Materials and Chemical Processing


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