ANSYS Wins Three TSMC Partner of the Year Awards

ANSYS recognized for leading-edge power and reliability analysis solutions

PITTSBURGH, Nov. 05, 2017 – With state-of-the-art power and reliability analysis solutions, TSMC and ANSYS enable customers to confidently develop next-generation mobile, high performance computing and automotive applications. In recognition of ANSYS' comprehensive solutions, TSMC presented ANSYS with three awards at this year's TSMC Open Innovation Platform (OIP) Ecosystem Forum.

ANSYS was awarded Partner of the Year for Joint Development of 12 nanometer FinFET Compact Technology (12FFC) Design Infrastructure; Partner of the Year for Joint Development of 7 nanometer FinFET Plus Technology (7nm+) Design Infrastructure; and Partner of the Year for Joint Delivery of Automotive Design Enablement Platform.

The awards for the Joint Development of the 7nm+ Design Infrastructure and 12FFC Design Infrastructure were awarded for ANSYS' delivery of foundry-certified power integrity and reliability analysis solutions for semiconductor intellectual properties (IP) and systems-on-chip designed using these advanced FinFET technology nodes.

The award for Joint Delivery of Automotive Design Enablement Platform was based on the successful development of an advanced electromigration (EM) analysis for TSMC's 16 nanometer FinFET Compact Technology (16FFC) process. In addition, ANSYS and TSMC collaborated on the Automotive Reliability Solution Guide which introduces various methodologies for reliability analysis including EM, thermal and electrostatic discharge to support customers' IP, and chip and package development for automotive applications in TSMC's 16FFC process.

"ANSYS is a valuable partner and we are pleased to recognize their efforts with these awards," said Suk Lee, senior director, design infrastructure marketing division at TSMC. "ANSYS helps our customers achieve faster design convergence with increased confidence."

"Through cutting-edge technology and market leadership, ANSYS provides higher value to our customers and has greatly accelerated the pace of innovation in recent years," said John Lee, general manager at ANSYS. "Receiving three TSMC Partner of the Year awards is a testament to our partnership and the value ANSYS delivers for electronics system reliability."

ANSYS solutions will be featured in various technical tracks during TSMC's OIP Ecosystem Forum in Shenzhen, China on Nov. 7, 2017.

Contact

Media
Mary Kate Joyce
724.820.4368
marykate.joyce@ansys.com

Investors
Annette Arribas, CTP
724.820.3700
annette.arribas@ansys.com

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