La domanda del mercato per prodotti smart a prezzi accessibili spinge le imprese high-tech a ridurre i prezzi, ridurre la potenza ed incrementare le prestazioni grazie all'integrazione di sempre maggiori funzionalità.
L’elettronica mobile, per esempio, si basa su sistemi di comunicazione wireless per connettersi ad Internet attraverso stazioni radio cellulari. Per fornire una connettività affidabile e robusta, gli ingegneri hanno bisogno di progettare sistemi di comunicazione in grado di supportare standard multipli, come Bluetooth, Wi-Fi e LTE.
- White Papers
- Designing Robust Electronics Systems - Article - ANSYS Advantage - V7 I2
- Predicting Circuit Board Hot Spots with Electrothermal Cosimulation - Article - ANSYS Advantage - V4 I1
- Avoiding the Perils of Electromagnetic Interference - Article - ANSYS Advantage - V4 I1
- Making the Switch - Article - ANSYS Advantage - V4 I2
Engineers designing mobile computing and communication products need to optimize form-factor, performance, and battery life while delivering a compelling user experience.
Whether designing high-definition image sensors for digital cameras or high-performance graphics processors to enable a realistic gaming experience, successful consumer electronics companies focus on driving down cost, integrating functionality, increasing product reliability and speeding time to market.
Communications and Networking Equipment
The proliferation of mobile and Internet-connected products creates a significant amount of data that needs to be stored, accessed and processed at rapid speeds, requiring delivery of high-bandwidth data reliably and efficiently.
Storage and Cloud
Storage and cloud technologies are integral to our digital lives and made possible by electronics simulation software.
Design Reliable Wireless Communication Systems
Wireless communication systems are powering the smart products revolution. Today’s smartphones and networked devices support multiple wireless technologies, such as Bluetooth, Wi-Fi and LTE. This level of integration requires engineers TO take steps to mitigate EMI/EMC issues as well as thermal issues.
Optimize Power, Performance & Cost
In the race to deliver low-cost, high-performance, power-efficient electronics and semiconductor products in a timely manner, engineers are adopting chip–package–system (CPS) design methodology that allows co-analysis and co-optimization across the entire system.