Semiconductor Applications

Innovation in semiconductor design and manufacturing is enabling smaller device architectures with higher performance and more energy-efficient devices for powering the smart product revolution. The physics associated with shrinking geometries, especially in the emerging 3-D IC, FinFET and stacked-die architectures bring out design challenges related to power and reliability, affecting design closure. ANSYS simulation and modeling tools offer you the sign-off accuracy and performance needed to ensure the power noise integrity and reliability of even the most complex ICs, taking into account electromigration, thermal effects and electrostatic discharge phenomena.

clicca il pulsante per contattare ANSYS