
Engineers in the scientific equipment and power electronics industry focus on the design of products like printers, copiers, imaging and testing equipment, electric motors, converters, switches, transformers and power supplies. Throughout the design process, there are several challenges such as the demand for continuous improvement in product efficiency, along with increased regulation on electromagnetic emission levels from governmental agencies. There is also a need for continuous product miniaturization, which coupled with increasing power densities, results in significant challenges to the product's thermal and mechanical reliability.
ANSYS offers the industrial equipment and power electronics industries a variety of engineering simulation tools including ANSYS Icepak, for thermal management, ANSYS Mechanical and ANSYS Structural for mechanical analysis and ANSYS Emag and ANSYS Multiphysics for electromagnetic simulation.
For thermal management, ANSYS Icepak is used to conduct system level CFD simulation including radiation, as well as natural and forced air cooling. The ANSYS Icepak simulation then acts as a guide for fan selection and heat sink design, allowing examination of the effect of various thermal designs on the overall system weight and size. ANSYS tools can be used to conduct detailed board and package level simulation that include the effects of joule heating in copper traces on the overall system thermal performance.
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Thermal management of power devices using ANSYS Icepak |
Using ANSYS mechanical simulation tools, you can examine thermo mechanical stresses in packages and boards that develop during thermal cycling. These tools can be used to conduct a shock and vibration analysis to examine stresses that develop during the motion of various parts in the system. Furthermore, with products like ANSYS Rigid Dynamics, you can analyze the kinematics of different assemblies and the parts of a fully rigid system, and then convert the parts of interest to be flexible for a more comprehensive rigid-flexible dynamics simulation.
Stress analysis of an electronics device using ANSYS Mechanical |
When conducting electromagnetic simulation, you can conduct board and system level signal integrity simulations as well as optimize system shielding and compliance with various emission regulations. With ANSYS Emag, you can conduct low frequency electromagnetic analysis, including electrostatics and magnetostatics applications, on still and rotating assemblies like rotors, stators or detailed electric motors.
Stress analysis of an electronics device using ANSYS Mechanical |
LF electromagnetic simulation on electric motor using ANSYS Emag |
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With the depth and breath of ANSYS capabilities, you can conduct comprehensive multidisciplinary simulations enabling you to quickly and accurately optimize product performance while meeting various mechanical, thermal and electromagnetic constraints. This optimization of product design, along with the reduction of your design cycle, will provide you with a significant advantage in cost reduction and in improved product innovation.