ANSYS in ACTION: Enabling FinFET Thermal Reliability Signoff for IPs - Webinar

ANSYS Totem can solve the challenges faced by engineers trying to ensure thermal and electromigration (EM) reliability in advanced IPs. View this webinar to see a demonstration of self-heat analysis on an IP test case using ANSYS Totem’s rich GUI interface. The demonstration will cover flow setup, debugging and result exploration for reliability signoff.