ANSYS Solutions for the Electronics Industry
 

ANSYS, Inc. provides the electronics industry with a comprehensive suite of simulation tools covering structural, thermal, CFD, electromagnetics and acoustics simulation. This free seminar will introduce analysts and designers to the depth of capabilities and the breadth of industry and physics applications in the product portfolio from ANSYS.

Agenda:

8:30 a.m. – 9:00 a.m. Registration
9:00 a.m. – 9:30 a.m. Welcome/Introduction of products and ANSYS® Workbench™
9:30 a.m. – 10:30a.m. Thermal management
  • Chip, board and system level analysis with ANSYS® Icepak® and ANSYS® Iceboard® software
  • Advanced cooling and acoustics modeling with FLUENT® and ANSYS® CFX® software
10:40 a.m. – 11:40 a.m. Structural and mechanical modeling
  • Thermal–mechanical stress and package reliability
  • Drop test and vibration analysis
11:40 a.m. – 12:30 p.m. Electromagnetic modeling
  • Parasitic extraction
12:30 p.m. – 1:30 p.m. Lunch
1:30 p.m. – 2:30 p.m. Multiphysics simulation
  • Piezoelectric and piezoresistivity
  • Thermal–structural–electric coupling
2:30 p.m. – 3:00 p.m. Product roadmap and close

Who should attend:

  • Users of ANSYS software who are interested in new capabilities and physics
  • Others interested in learning about product offerings from ANSYS