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Chip Package Co-Analysis of Thermal-Induced Stress for Fan-Out Water Level Packaging

This paper presents an innovative co-analysis solution for thermal-induced stress of fan-out wafer level packaging (FOWLP). The reliability of FOWLP on either the fan-out package region or in the chip IDLs are of concern for loadings from large differential thermal expansions at Si chip and package/PCB interfaces and Tg (Glass Transition Temperature) effects in the dielectric materials. The dielectric layers in WLP and IDL of a chip are of weak ELK materials which are easy to develop crack at relatively low stress levels. The drastic property changes, for example, 30x change in Coefficient of Thermal Expansion (CTE) at Tg, aggravates the development of micro-flaws and the coalesce into long cracks which leads to eminent failure of the FOWLP. The approach in thermal-induced stress analysis includes the generation of thermal-aware chip power maps for multiple dies in FOWLP, the conversion of converged thermal profiles in FOWLP to thermal loadings for stress analysis, efficient model generation and analysis for Tg effect of non-linear material properties, and detailed sub-modeling of on-chip structures for thermal-induced stresses. Discussions of innovative thermal-induced stress modeling process and results extraction for a FOWLP test case are demonstrated.

Author: Type: Conference Paper Date:
Product Category: Electronics
Industry: Consumer Products


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An Efficient Transient Thermal Simulation Methodology for Power Management IC Designs - Conference Paper

Power Management devices are becoming ubiquitous in every electronic system for achieving energy efficiency with constrained power/thermal budget. Multi-Function and Multi-Channel PMICs are becoming common design trend to support diverse voltage/power requirements of complex SoCs. In this paper, we present an approach to perform a full chip level thermal analysis with the capability to perform a detailed sub-modeling for electro-thermal analysis with Finite Element method and perform thermal-aware EM and stress analysis. The approach in transient thermal, thermal-aware EM and stress analyses includes the generation of thermal-aware chip power maps, conversion of converged thermal profiles in Power Devices to thermal loadings and detailed sub-modeling of on-chip structures for transient thermal, thermal-aware EM and thermal-induced stress analyses.

Author: ANSYS, Inc. Type: Conference Paper Date:
Sub Industry: Semiconductors


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Computational-based MRI Thermal Injury Risk Assessment for Patients Implanted With Passive Spinal Devices - Webinar

Using computational modeling and simulation (CM&S) to generate evidence that a medical device meets regulatory standards is evolving quite rapidly. Regulatory agencies such as the FDA are increasingly accepting simulation data as part of the approval process. In this webinar, we will address the use of CM&S to assess the safety of patients with implanted passive devices who must undergo MRI scanning. The goal is to answer the question, “Will radio-frequency field interaction with the implanted device induce unsafe high temperatures in the surrounding tissues?”

Attend this webinar to learn more about the role of CM&S as a tool in generating evidence for MR device safety. The speaker will also cover important topics such as worst-case selection methodology and computational model verification, validation and uncertainty quantification.

Author: ANSYS Type: Webinar Date:
Industry: Healthcare - BioMed
Sub Industry: Orthopedics, Diagnosis and Personalized Medicine


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Enabling ESD Reliability Signoff for AMS IPs - Webinar

View this webinar to discover how ANSYS PathFinder can help you solve the challenges you face in trying to ensure ESD robustness in today’s AMS IPs. Watch a live demonstration of ANSYS PathFinder on an IP-level test case to highlight the benefits of a layout-based ESD integrity solution for resistance and current density checks.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS PathFinder
Product Category: Electronics


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Autonomous Vehicle Radar: Improving Radar Performance with Simulation - White Paper

As the world draws near to the reality of fully autonomous automobiles and transport vehicles, there is a great deal of focus on the development of artificial intelligence (AI), machine learning and rapid automated decision-making. These solutions are aimed at duplicating — and improving upon — a human’s ability to perceive the world around them, and at efficiently and safely guiding a vehicle through a journey. A critical aspect of autonomous vehicle control is the continued evolution of vehicle sensors — the eyes and ears of the control system that perceive the operational characteristics of the vehicle and the environment around us. While the AI and decision-making systems must plan the vehicle trajectory and response to the environment, the sensors must feed the control systems executing those algorithms with accurate data on the current and developing state of the vehicle’s surroundings. The development of accurate algorithms depends in part upon the availability of accurate sensor data.

Author: ANSYS, Inc Type: White Paper Date:
Product Name: ANSYS HFSS
Industry: Automotive


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Racing to the finish line with ANSYS AIM - Video

Easy-to-use Discovery AIM can optimize designs for high-tech Formula cars ... and just-for-fun Pinewood Derby cars.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS AIM
Product Category: Academic
Industry: Automotive, Consumer Products


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Linear Static Example with Discovery AIM - Video

Discovery AIM’s custom applications enable the automation of simulation workflows to ensure accurate results and best practices.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS AIM
Product Category: Academic
Industry: Automotive, Consumer Products


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Demonstration of Discovery AIM: Simulation for Every Engineer - Video

Follow along in this Discovery AIM evaluation of the fluid, thermal and structural performance of a butterfly valve.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS AIM
Industry: Aerospace and Defense, Automotive, Construction, Consumer Products, Energy, Healthcare - BioMed, High Tech, Industrial Equipment, Materials and Chemical Processing


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Custom Apps in Discovery AIM - Video

In this demonstration video, the virtual wind tunnel app in Discovery AIM is used to evaluate the aerodynamic performance of several designs.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS AIM
Industry: Aerospace and Defense, Automotive, Construction, Consumer Products, Energy, Healthcare - BioMed, High Tech, Industrial Equipment, Materials and Chemical Processing


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Linear Static Analysis with ANSYS AIM - Video

This video shows a linear static analysis of a tractor axle assembly using one of Discovery AIM's predefined physics templates.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS AIM
Product Category: Platform


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