Semiconductor Applications

Innovation in semiconductor design and manufacturing is enabling smaller device architectures with higher performance and more energy-efficient devices for powering the smart product revolution. The physics associated with shrinking geometries, especially in the emerging 3-D IC, FinFET and stacked-die architectures bring out design challenges related to power and reliability, affecting design closure. ANSYS simulation and modeling tools offer you the sign-off accuracy and performance needed to ensure the power noise integrity and reliability of even the most complex ICs, taking into account electromigration, thermal effects and electrostatic discharge phenomena.

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