Thermal management in electronics requires that temperatures of all components be maintained within a safe operating range. The engineering of thermal performance is no longer limited to a single device and its primary cooling mechanism alone, but often involves many other parts in the system — a neighboring package, a distant fan, or a chassis sheet metal. In addition, multi-physics coupling considerations are required to fully account for the electro-thermal and thermo-mechanical effects on the design.
ANSYS Icepak is a powerful thermal analysis CFD tool that allows engineers to model complex electronic systems, and perform heat transfer and fluid flow simulations on component-level, board-level or system-level applications. The ability to import and modify MCAD and ECAD geometry, coupled with extensive multi-physics capabilities, as well as accurate body fitted meshing, make Icepak the tool of choice when sign-off accuracy is required.
In this hands on event, you will hear an overview of ANSYS Icepak and complete two workshops designed to provide a panoramic feel of the ANSYS Icepak workflow.
Seating is limited to 12 students. Lunch will be served.