Electronics Thermal Management Using ANSYS Icepak

28 de septiembre de 2017

2:00 PM - 5:00 PM (CST)

REGISTRO ›

Venue:
HofbrÀuhaus Chicago
5500 Park Place
Rosemont, IL 60018
USA

Contact:
Krista Loeffler
krista.loeffler@ansys.com

Thermal management in electronics requires that temperatures of all components be maintained within a safe operating range.  The engineering of thermal performance is no longer limited to a single device and its primary cooling mechanism alone, but often involves many other parts in the system — a neighboring package, a distant fan, or a chassis sheet metal.  In addition, multi-physics coupling considerations are required to fully account for the electro-thermal and thermo-mechanical effects on the design.

ANSYS Icepak is a powerful thermal analysis CFD tool that allows engineers to model complex electronic systems, and perform heat transfer and fluid flow simulations on component-level, board-level or system-level applications.  The ability to import and modify MCAD and ECAD geometry, coupled with extensive multi-physics capabilities, as well as accurate body fitted meshing, make Icepak the tool of choice when sign-off accuracy is required.  

Join us for a panoramic feel of the ANSYS Icepak workflow.

 

 

 




Join ANSYS in a demonstration of how engineering simulation can help you address these challenges effectively.