ANSYS Northern California Innovation Conference

16. August 2017

9:00 AM - 4:00 PM (PDT)


Plug and Play Tech Center
440 N. Wolfe Road
Sunnyvale, CA 94085

Verly Flores

Today’s engineering teams are challenged to design products in an incredibly complex environment. With the growth of the Internet of Things, products are increasingly a medley of mechanical, electronics and software subsystems with smart functionality. Designing such complex products requires a comprehensive, integrated simulation platform that can handle single and multiple physics simulations efficiently and automatically. ANSYS Platform — the world’s leading simulation environment — is the answer to these challenges.

Join ANSYS for an informative conference on how to incorporate ANSYS Platform and productivity enhancement tools — including digital twins — into your engineering department’s workflow. ANSYS technical experts and presenting customers will discuss design challenges and how a consolidated simulation platform can help you drive efficiency across your enterprise by providing the bi-directional connectivity characteristic of digital twins.

At the Innovation Conference, you can expect to collaborate, share information and learn how to optimize your use of engineering tools, data, and business processes. 

Please register early to reserve your spot. We look forward to seeing you at the event!


Time Topic
9:00 - 9:30 AM Registration & Breakfast Reception
9:30 - 9:40 ANSYS Welcome
William Schulz, Regional Sales Director, Northern California, ANSYS
9:40- 9:50 Welcome to Plug and Play Tech Center
Sobhan Khani, Director - Mobility, Plug & Play Tech Center 
9:50 - 10:35 Keynote: Speed of Light Execution Enabled by Simulation
Sunil Sudhakaran, Director Hardware Engineering (Signal & Power Integrity), NVIDIA 
10:35 - 10:50 Networking Break
10:50 - 11:25 Keynote:Capturing Multi-Scale Multi-Physics Interactions: A Key to Innovation in High Fidelity Predictive Analytics
Azam Thatte, Ph.D., Director of Advanced Research,
Head of the Center for Multi-Scale Multi-Physics Computations, Energy Recovery
Visiting Scholar, Department of Aeronautics & Astronautics, MIT
11:25 - 12:00 Wearable Medical Devices: Part Technology, Part Regulation and Lots of Hype
Jorge A. Ochoa, Ph.D., Principal Engineer, Exponent, Inc.
12:00 - 1:00 Networking Lunch
1:00 - 1:30 Cylindrical Geometry Energy Storage Cooling Architectures
Guy Wagner, Director, Electronic Cooling Solutions, Inc. 
Digital Prototyping for Electronic Systems with ANSYS CPS-MT
Robert Myoung, Principal Engineer, ANSYS
1:30 - 2:00 The Volute, Inc. Conformable Hydrogen Tank: A Case Study in Simulating Very Destructive Testing for Fast, Low-Cost Product Development
Dan Recht, CEO,
Karthick Chandraseker, Senior Engineer, Volute, Inc.
Leveraging Simulation for Ensuring PCB Reliability
Monem Alyaser, Ph.D., Principal Engineer, Almaden Consulting, Inc. 
2:00 - 2:30 ANSYS Solutions for Additive Manufacturing 
Kelly Morgan, Senior Application Engineer, ANSYS
ANSYS HFSS Antenna 3-D Component Library
Manuel Carmona, Sr. RF Engineer, Johanson Technology
2:30 - 3:00 Becoming Proficient Across Multiple Physics Through ANSYS AIM
Ming Yao Ding, Lead Application Engineer, ANSYS
ANSYS Signal Integrity Automation Platform
Pranav Devalla, Application Engineer, ANSYS 
3:00 - 4:00 Networking Reception, Light Hors D'oeuvres & Cocktails

Keynote Speakers

Sunil Sudhakaran

Director Hardware Engineering (Signal & Power Integrity), NVIDIA


Sunil is the Director of Signal and Power Integrity (SI/PI) at NVIDIA. NVIDIA's invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI -- the next era of computing -- with the GPU acting as the brain of computers, robots and self-driving cars that can perceive and understand the world. This transformation has required steadfast focus across engineering teams including the SI team. In particular, the transformation created new SI/PI challenges including productizing mobile processors, silicon interposer technology, and complex server class products. Sunil and his team are focused on developing new methodologies to properly model such technologies to avoid go-to-market (GTM) issues for NVIDIA. His team is involved throughout the design and bring-up phases, focusing on feasibility studies early on to help define PHY architecture and design rules to final design verification for package, PCB, and design for test platforms. Sunil’s team is also responsible for measuring and assessing the overall package & PCB manufacturing quality along with supporting validation teams during the bring-up phase. In addition to SI/PI methodology contributions, Sunil has defined much of the current project infrastructure to streamline SI/PI development. His professional research interests span the field, but have been recently focused on I/O link modeling and correlation. Sunil recently received the Best Paper Award at the 2016 EPEPS Conference and has authored/co-authored several publications and patents. He has a BS Degree in Computer Engineering from the University of Wisconsin-Madison and a MSEE degree from Stanford University.

Azam Thatte, Ph.D.

Director of Advanced Research, Head of the Center for Multi-Scale Multi-Physics Computations, Energy Recovery
Visiting Scholar, Department of Aeronautics & Astronautics, MIT


Dr. Azam Thatte is the director of advanced research and engineering at Energy Recovery and a visiting research scholar at MIT. He received his Ph.D in Mechanical Engineering from Georgia Tech where he developed state of the art computational and experimental methods for solving coupled physics interfacial dynamics & multi-scale fluid-structure interactions, nano-scale visco-elastohydrodynamics & molecular dynamics problems and for developing time resolved atomic force microscopy techniques. At Energy Recovery, Dr. Thatte and his team are developing revolutionary pressure & energy recovery machines and advanced high power density turbomachines. There he also leads the Center for Multi-Scale Multi-Physics Computations and has developed high fidelity models for multi-scale flows, flow induced vibrations, wave propagation, particle transport, erosion, rotordynamics, multi-phase compression, turbochargers, film riding bearings etc. In his prior role Dr. Thatte was the lead research scientist at GE’s Research Center where he developed next generation aircraft engines, gas turbines, compressor and propulsion technologies. As the Principal Investigator on a U.S Department of Energy’s research grant, Dr. Thatte led the development of a revolutionary energy technology like the first 10 Megawatt Scale Supercritical CO2 Turbine. For U.S. Dept. of Energy’s PREDICTS program, he led development of advanced computational models for capturing phase transition & multi-phase flows, ice crystal formation, real gas effects, acoustic-structure interactions, fracture mechanics & fatigue crack propagation, corrosion and Bayesian hybrid probabilistic models performance and life prediction of supercritical CO2 turbomachines. At MIT Dr. Thatte developed new methods for precise droplet transport & manipulation using electro-wetting, nano-engineered surfaces for ultra-hydrophobicity, thermal transport and ice crystal prevention, acoustically controlled droplet transport & oscillations, variable focus optical lenses using microfluidics, electro-coalescence  etc. for applications in MEMS, sensors, micro/nano energy systems & biomedical field.  Dr. Thatte was also part of a NASA team, where his advanced signal extraction algorithms were instrumental in detection of an organic molecule on a planet outside our solar system for the first time in human history. This discovery was published in the journal Nature in 2010. Dr. Thatte has more than 40 journal / peer reviewed conference publications and has 15 patents granted / filed. He has also received Young Tribologist award from STLE, two Inventor Medals from GE and Paul Cook Innovation Award from ERI.


Speed of Light Execution Enabled by Simulation
Sunil Sudhakaran, NVIDIA

Speed of light (SOL) execution is the cornerstone of NVIDIA’s business strategy and corporate culture. It is the minimum upper bound that is paradoxically within reach yet unattainable, and in the context of developing and productizing new technologies, it quite simply means as fast as possible. The majority of NVIDIA’s product linesare comprised of cutting edge processors which involve lengthy development cycles that include architecture, design, verification, fabrication, and post-silicon validation phases. Over-designing by simply adding cost to products is not feasible for competitive concerns, so design robustness needs to be cost aware. SOL execution requires excellence on the first try while being cost sensitive and anything else is considered to be a failure. One key practice is paramount for such an execution model: simulation.

Simulation is performed extensively throughout the design cycle at NVIDIA. This presentation primarily covers simulations related to system design including I/O interfaces and chip power delivery. NVIDIA is at the forefront of wireline link technology having productized a 11Gbps single-ended GDDR5x memory interface and the eponymous NVLink interface enabling GPU-GPU communication with data rates far exceeding existing PCI-Express technologies. Such high-speed interfaces require SI modeling with extreme attention to detail and unparalleled accuracy. SI feasibility simulations for these high-speed interfaces are carried out early in the development cycle to help define product architecture and specifications and continue until processor tapeout where the focus shifts towards verification. Furthermore, as systems are now power limited due to the end of Dennard scaling, a colossal burden is placed on the power distribution networks feeding into the chip due to the larger di/dt. Power integrity simulations are carried throughout the design cycle to guarantee power supply noise targets can be met.

In order to fit within development cycles and not become critical paths in and of their own, simulations need to be blazing fast. Using multiple CPU cores has provided appreciable yet incremental speedups for SI simulations. NVIDIA has shown across several applications that the time for GPU computing has come. Aforementioned mentioned SI & PI analyses need to leverage the power of GPU computing to provide non-incremental speedups to scale with accelerated product development cycles. Finally, the recently ignited AI big bang can most definitely revolutionize such simulation approaches.

Capturing Multi-Scale Multi-Physics Interactions: A Key to Innovation in High Fidelity Predictive Analytics
Azam Thatte, Ph.D., Energy Recovery

Necessity to solve multi-scale coupled-physics problems has been at the forefront of the technological challenges faced by academia and high tech industry for decades. Inability to resolve the interdependence between partial differential equations (PDE) governing interacting physical phenomena in a strongly coupled manner had traditionally limited the ability of researchers to produce high fidelity predictions. In addition the physics interactions occurring simultaneously across a broad spectrum of length & time scales demand either prohibitively expensive computations or intelligent multi-grid methods. Multi-scale fluid-structure interactions, magneto-hydrodynamics, Lagrangian particle transport in Eulerian flow field, piezoelectric-acoustics transduction, vortex shedding & flutter in aircraft engines, acoustic wave propagation, fracture mechanics & flow through multi-scale geological structures, chemical species diffusion, transiently vanishing domains, electro-coalescence, non-equilibrium nucleation & phase change are among the problems of this class. The talk will highlight some of these problems and coupled PDE based methods to solve them. Arbitrary Lagrangian Eulerian (ALE) approach developed for multi-scale visco-elastohydrodynamics will be discussed. Application of Level Set & Volume of Fluid methods for droplet & bubble dynamics, for designing opto-fluidic devices using electrostatic dilation & translation of droplets and for studying super-hydrophobicity & ice-phobicity on nano-engineered surfaces will be presented. Also, recently a supercritical CO2 turbine has been proposed as a radical change in the way the energy will be produced in the future. Some of the design challenges of this novel turbine like the sonic transition, phase change & multi-phase compression, metastable states and flow induced vibrations that are addressed with advanced coupled-physics models will be presented. Lastly Energy Recovery’s revolutionary new technologies for pressure & energy exchange and its advanced coupled-physics predictive analytics platform will be discussed. 

Wearable Medical Devices: Part Technology, Part Regulation and Lots of Hype
Jorge A. Ochoa, Ph.D., Exponent, Inc.

The current regulatory environment and technology advances in the United States have created an environment in which safety and efficacy issues of medical devices are at a unique crossroads. FDA is taking a more definitive and proactive stance on postmarketing surveillance, quality, and innovation, which may impact device effectiveness and patient safety. At the same time, introduction and adoption of novel technologies is not only facilitating the development of totally new medical device treatment modalities, but these new technologies are rapidly transforming established medical device domains such as orthopaedics and cardiovascular. In addition, the blurring of the line between health-related consumer products and medical devices have created an environment where device safety and effectiveness can be at risk. This may stem from potential confusion and overlap of technical and regulatory requirements, development processes, and associated device performance and post market surveillance requirements of device manufacturers. This is especially challenging for companies whose base is in consumer products and have ventured into the medical device space.

We will review the latest trends in new technological and regulatory areas of emphasis such as additive manufacturing, cybersecurity, “wearables,” FDA’s case for quality, postmarketing surveillance, and Human Factors and Usability Engineering.

How well a company manages these new technological trends and regulatory approaches, can affect not only the future viability of their current and future product lines, but can also affect the company’s liability, and financial loss. Most importantly, hiccups in a company’s ability to maintain compliance with updated regulations and effectively verify and validate new technologies in their products can also affect a company’s good will, reputation, and "brand equity."

Cylindrical Geometry Energy Storage Cooling
Guy Wagner, Electronic Cooling Solutions, Inc.

This presentation will demonstrate the thermal performance of an innovative assembly for cooling cylindrical battery cells that are generating heat during rapid charge and discharge cycles. The standard practice for cooling cylindrical cells is blowing cooling air between the cylinders to remove the heat. By replacing the air with low cost heat pipes and a small amount of non-conductive heat transfer fluid, the temperature excursions of the cells can be significantly reduced.

The presentation will show the use of CFD modeling of the battery assembly using Icepak. The simulation will show the difference in cooling performance of the battery assembly when cooled with air and the proposed heat pipe/fluid cooling array. This cooling technology has application when batteries are stressed beyond their normal limits during very high charge and discharge rates.

The Volute, Inc. Conformable Hydrogen Tank: A Case Study in Simulating Very Destructive Testing for Fast, Low-Cost Product Development
Dan Recht and Karthick Chandraseker, Volute, Inc.

Volute, Inc. develops conformable gas tanks for hydrogen vehicles that fold to store high-pressure hydrogen in spaces of any shape. Our patented technology makes more room for cargo and passengers by replacing bulky cylinders with a lightweight carbon fiber tank that fills all available space and also stores more fuel when used as a drop-in replacement for a traditional gas cylinder. The tanks are tested rigorously in accordance with established fuel cell vehicle regulations to ensure safety and reliability. Many of the required tests are destructive and so we use simulations extensively both to improve test safety and to accelerate any design iterations needed to reliably pass tests. As a case study, we show how we recently used simulations to safely conduct and pass a fire resistance test which requires a gas-filled pressurized tank to be exposed to localized and engulfing fire without rupturing.

Leveraging Simulation for Ensuring PCB Reliability
Monem Alyaser, Ph.D., Almaden Consulting, Inc.

As product performance increases and form factor decreases, the complexity of the product design increases. With increasing concentrated power dissipation from main components, the thermal gradients on a PCB often become significant enough to require optimal thermal design. PCB layout and component placement are dictated by logic design and often there is minimum flexibility to accommodate the thermal design requirements. To meet high reliability requirements, with minimum R&D costs and time-to-market, integrated product design processes have to be employed where CAD, EDA, CFD and FEA have to be utilized, seamlessly. In this presentation, integrated thermal design with ANSYS CAE tools is discussed with some examples.  

Digital Prototyping for Electronic Systems with ANSYS CPS-MT
Robert Myoung, ANSYS

The modern electronic system’s Power Efficiency/Integrity & Reliability analysis is a critical area that we need to justify based on the dynamic voltage noise budget at chip, package and board level PDN target impedance calculation with Electro Magnetic coupling prediction without diminishing the accuracy and performance of the simulation.

ANSYS has a specialized design platform for power integrity, signal integrity and EMI analysis of IC packages and PCBs. This AEDT(Ansys Electronic Desktop) & SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. ANSYS’ full wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low voltage designs.

This presentation will use INTEL Galileo main PCB with custom application processor and memory to demonstrate ANSYS CPS-MT(CPS Mechanical and Thermal) solution.

In this presentation, ANSYS will demonstrate industry-leading unified CAD interface that enables electrical/thermal and mechanical engineering collaboration;

  • Accurate CPS SI/PI/EMI modeling capability
  • Accurate chip thermal model generation (CTM) to support thermal management of  Package and board system
  • Unique workflow to Identify thermal/structural impact for component life prediction and system reliability study

ANSYS Solutions for Additive Manufacturing
Kelly Morgan, ANSYS

Additive manufacturing, rapid prototyping, reverse engineering, and topology optimization increasingly play a vital role in the design of innovative products. We will be discussing how to perform physics-driven free-form design optimization to reduce material waste, minimize weight, while improving product durability and reliability.

Becoming Proficient Across Multiple Physics Through ANSYS AIM
Ming Yao Ding, ANSYS 

Simulation is often a full time job, and learning to do simulation effectively in multiple physics is challenging even for experienced analysts. ANSYS AIM lowers the learning curve and makes simulation in multiple physics approachable to all engineers. This presentation will describe the rapid pace of improvements in the AIM toolset, how AIM is tailored to make simulation easy, and how to link AIM with existing ANSYS simulation tools to enable collaboration between all ANSYS users.