Electrical & Electronics

Almost half the value of next-generation automobiles is expected to come from onboard electronics and electromechanical components. Manufacturers in this industry are using advanced electronics within sophisticated engine and safety controls and electric/hybrid electric drives as well as in the design of navigation, audio systems and LED lighting. As a result, automotive electronics engineers face a variety of design challenges.

Engineers must design products that will survive in harsh operating conditions, such as significant swings in humidity levels and large temperature variations that range from 50 degrees C to -20 degrees C. In addition, products must demonstrate relatively long product lifecycles. The auto industry is governed by high safety and reliability standards. And finally, there are stringent weight restrictions due to the demand for reduced fuel consumption.

Cooling analysis of transmission controller IC package

Courtesy Delphi.

The best product engineering tools reduce reliance on physical prototyping through virtual simulation. The ANSYS suite goes far beyond, facilitating communication across various engineering disciplines. For the automotive industry, this is a key initiative for expediting the design cycle and reducing the risk of product recalls.

Unparalleled breadth and depth are at the foundation of ANSYS products, enabling individuals and teams to conduct comprehensive multiphysics and multiscale simulation. The end result is a product design that is optimized for performance and reliability under harsh operating environments — and one that considers the industry’s strict weight limitations.

ANSYS offers automotive electronics designers a variety of engineering simulation tools that address the multiple physics problems inherent to component and system design. 

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Thermal Management Thermal Management

In resolving battery problems, engineers apply the advanced CFD technology of ANSYS FLUENT software to examine electrochemistry and to develop advanced battery cooling solutions.

Other thermal management applications call for ANSYS Icepak technology. This software can be used for package-, board- or system-level CFD simulation, including natural and forced convection and radiation heat transfer. Product developers can incorporate effects such as joule heating phenomena in package or board substrates — either through approximate calculation within the CFD solver or by transferring power distribution data gleaned from simulation with the ANSYS power and signal-integrity tool, SIwave.

Mechanical & Thermomechanical Mechanical & Thermomechanical

For mechanical and thermomechanical simulation, ANSYS provides a comprehensive solution for performing structural analysis, including ANSYS Mechanical and ANSYS Structural packages for mechanical reliability and stress analysis. The structural mechanics suite includes a full complement of nonlinear and linear elements as well as a complete set of finite element behavior and material laws. ANSYS Fatigue software can be used to simulate product performance under anticipated cyclic loading conditions over the product's expected lifespan. ANSYS also offers a complete set of implicit and explicit solvers, enabling engineers to simulate mechanical stresses and strains — such as through explicit drop testing — that develop during episodes of shock and vibration.

High-Frequency Electromagnetics High-Frequency Electromagnetics

For high-frequency electromagnetics exploration, ANSYS offers HFSS and Designer RF. Engineers use the tools to conduct 3-D electromagnetic simulations and RF circuit simulation for antenna, GPS, and various wireless design applications. In the areas of signal and power integrity (SI/PI) as well as electromagnetic interference and compatibility (EMI/EMC) analysis, ANSYS offers HFSS, SIwave and DesignerSI technologies, which function as high-fidelity electromagnetic simulation tools and high-speed SI circuit simulation tools.

Low-Frequency & Electromechanical Low-Frequency & Electromechanical

Low-frequency and electromechanical system simulation tools are needed for applications including electric and hybrid electric vehicles, power electronics, sensors, and actuators. To solve inherent design issues, ANSYS offers the low-frequency electromagnetic simulation tool Maxwell and the electromechanical system simulation tool Simplorer. Users can combine Simplorer with ANSYS 3-D electromagnetic, mechanical and fluids solvers to design, integrate and verify complex components and subsystems into integrated and optimum systems.

Power Management Power Management

The auto industry’s increased use of on-board electronics for guidance, entertainment and safety control systems has created substantial integrated circuit (IC) and system-on-chip (SoC) design challenges to deliver energy and cost-efficient – yet highly reliable – electronics systems. As the use of on-board electronics in vehicles rises, power management plays a more critical role in automobile reliability.

To address power management, microcontroller units (MCUs) and other chips controlling on-board systems require a lower voltage rate to ensure consistent and reliable operations. One solution that addresses this issue is the advanced chip design tool PowerArtist, a register transfer language (RTL) power analysis and optimization platform from ANSYS subsidiary Apache Design. The solution enables design teams to obtain deeper insight into circuit power consumption at an early stage; it also allows implementation of power-optimization techniques. PowerArtist’s proprietary technologies ― PowerArtist Calibrator and Estimator (PACE) and RTL Power Model (RPM) ― help designers both to lower power and ensure power delivery network integrity. Providing early power analysis, power reduction and design optimization assists in meeting power budget requirements and increasing overall power efficiency.

On-board electronic systems can impede each other’s operation due to electromagnetic interference (EMI) noise, which can further compromise reliability. Our comprehensive chip-package-system (CPS) codesign/coanalysis methodology considers the impact of IC on system-wide EMI. The RedHawk full-chip power integrity and sign-off platform analyzes component activity and simulates the electromagnetic excitation it causes via a chip emission model (CEM). Sentinel-PSI and ANSYS SIwave use this CEM to perform systems-level EMI analysis, ensuring that the system design meets near- and far-field electromagnetic field distribution and that the final electronic system is EMC compliant.