Save Query
Load Query

Narrow Your Search

Language

Resource Type

Product Category

Product Name

Industry

Sub Industry

Show Results
1 - 10 Of 746 Results
1 2 3 4 5 75
Arrow

Solutions de simulation multiphysiques pour le développement de systèmes d'électronique de puissance - Webinar

Vous êtes confrontés à des challenges de mise au point, de performance, de maîtrise des délais et des coûts dans le domaine de l'électronique de puissance ?

Dans ce webinar, vous découvrirez comment la simulation multi-physiques apporte une solution fiable et innovante permettant d'analyser et d'optimiser la performance d'un système.

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Multiphysics, Electronics


Request

Arrow

Leveraging Big Compute for Aerodynamics Shape Optimization - Webinar

While most companies rely on local workstations and/or in-house high-performance computing (HPC) clusters for their engineering simulation workflows, there is a gradual shift toward cloud computing. Many are now adopting private enterprise cloud environments and external HPC cloud services to perform large and complex simulations.

ANSYS partners with Gompute, a leading HPC cloud services provider, to help you create a private CAE cloud solution or expand your compute capacity with on-demand access to its cloud platform. In this webinar, learn to run your ANSYS simulations in the Gompute cloud — featuring 3-D remote visualization over high latency links and large data transfers.

KeelWit Technology, a Spanish engineering company, will share how it is leveraging Gompute’s cloud platform to optimize aerodynamic shapes. KeelWit will present its optimization methodology and proprietary algorithm — an automatic, flexible and robust routine that is applicable to many fields in which cloud HPC use is key. KeelWit’s methodology is directly applicable in many areas, including the inlet duct design of industrial boilers used in combined cycle power plants, the design of closed wind tunnels for indoor skydiving and the design of energy-efficient, next-generation waterslides for fun parks.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Cloud Hosting Partners
Product Category: High Performance Computing, Cloud and IT Solutions


Request

Arrow

Enabling Power and Reliability Signoff for AMS Designs - Webinar

View this webinar to learn how ANSYS Totem can model and simulate the required power and reliability signoff checks for AMS designs. This presentation will demonstrate the benefits of using Totem to perform dynamic voltage drop and EM checks through its rich GUI interface, which can also be leveraged for debugging purposes.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Totem
Product Category: Electronics
Sub Industry: Electrical and Electronics


Request

Arrow

Solving Pharma & Life Science Design Challenges in the Cloud with ANSYS and Penguin Computing On-Demand - Webinar

Discover how CRB is solving the design challenges of its clients in advanced technology industries around the world with ANSYS and Penguin Computing on Demand (POD), an HPC cloud platform.

POD enables ANSYS customers to utilize a high-performance, bare-metal HPC computing environment in the cloud without having to invest in on-premise infrastructure. With POD you can take advantage of scalability, performance and free expert support in a secure on-demand environment.

View this webinar and learn how you can continue to work with familiar tools such as ANSYS Workbench with Remote Solve Manager on POD's Scyld Cloud Workstations.  ANSYS customers can work with both individual product licenses or ANSYS Elastic Licensing on POD.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Cloud Hosting Partners
Product Category: Cloud and IT Solutions, High Performance Computing
Industry: Healthcare - BioMed


Request

Arrow

ANSYS in ACTION: Enabling Early Power and Reliability Analysis for AMS Designs - Webinar

View this webinar to discover the benefits of doing early power and reliability analysis with just a GDS layout. This presentation will demonstrate early IP level connectivity checks; missing via checks; point to point resistance and short path resistance checks; and early static analysis to identify structural design weaknesses using ANSYS Totem’s rich GUI interface.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Totem
Product Category: Electronics


Request

Arrow

ANSYS in ACTION: Analog and Mixed Signal Workflows for Power and Reliability Signoff for SerDes IP and PMIC - Webinar

Analog and mixed signal IPs are very complex and require significant time to design, verify and validate. With increasing mask costs and tighter design cycles, first time silicon success is key to accelerate time to market and beat the competition. Watch this 20-minute webinar to learn how AMS workflows based on ANSYS Totem, a layout-based transistor level power and reliability signoff platform, can enable you to design the next generation of SerDes IP or PMIC for cutting-edge applications.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Totem
Sub Industry: Semiconductors


Request

Arrow

High Capacity Power Signoff Using Big Data - Webinar

In this webinar, learn how NVIDIA has developed a workflow to run a flat, full-chip power integrity and reliability signoff analysis using a fully distributed compute and big data solution with ANSYS RedHawk-SC. They achieved a turn-around time of well under 24 hours for full-chip flat power signoff analysis on NVIDIA’s largest GPU – Volta, which contains around 21 billion transistors. Additionally, silicon correlation exercises performed on the Volta chip using RedHawk-SC produced simulated voltage values that were within 10 percent of silicon measurement results. This methodology was published in the Design Automation Conference 2017 (DAC 2017) Designer/IP track poster session. Discover how NVIDIA’s most powerful GPU uses ANSYS’ next generation SoC power signoff solution based on big data to deliver the best performance for cutting-edge AI and machine learning applications.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS RedHawk


Request

Arrow

ANSYS Discovery Live and Geometry Modeling - Webinar

ANSYS SpaceClaim, which allows you to create and edit virtually any 3-D CAD file, provides the geometry backbone for this application. As fast as you can make changes to models, Discovery Live provides instant engineering simulation answers. This combination empowers true upfront simulation. Join us for this webinar and learn about several ANSYS concept modeling tools along with the power of direct modeling in SpaceClaim. You'll walk away being able to edit models as fast as Discovery Live solves them.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Discovery Live, ANSYS SpaceClaim
Product Category: 3-D Design


Request

Arrow

Concept Modeling and Simulation with ANSYS SpaceClaim - Webinar

Watch this webinar to explore ANSYS SpaceClaim's 3-D concept modeling capabilities. We’ll demonstrate the power that direct modeling brings to various workflows, such as design, manufacturing, 3-D printing, reverse engineering, sheet metal fabrication and engineering simulation. You’ll learn how SpaceClaim can be used for rapid concept development starting from a blank screen or imported file; how it creates and edits assemblies; and how rapidly it can make detailed 2-D drawings.

Finally, we’ll demonstrate SpaceClaim technology in the context of an engineering simulation using a new product called ANSYS Discovery Live, a revolutionary solution that rewards you with instantaneous simulation results as soon as you change the geometry or other parameters of your model. Attend this webinar and you’ll walk away more confident in your ability to perform concept modeling and true upfront simulation.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS SpaceClaim, ANSYS Discovery Live
Product Category: 3-D Design


Request

Arrow

Physics-based Simulation Solutions for Power Electronics System Development - Webinar

Watch this recorded webinar to learn how you can use ANSYS Simplorer to solve your toughest challenges in designing power electronics systems. The webinar focuses on power losses and thermal design; EMC conducted noise; and analysis of failure modes through fault injection.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Simplorer
Product Category: Electronics


Request

1 - 10 Of 746 Results
1 2 3 4 5 75
 
Contact

This website uses cookies to improve user experience. By using our website you consent to all cookies in accordance with our Cookie Policy.

Accept Learn More