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混合有限元边界积分法

随着近期积分方程求解效率的提高,现在我们可以在混合有限元边界积分法(FEBI)中将积分方程法和有限元法相结合(FEM)[1]。在电磁学中,FEM是一种通用技术,该技术既支持体积电场求解,又能精确地描述微波组件、天线和信号完整性问题[2,3]。对于天线或散射问题,必须包含围绕模型的空气域,并且用吸收边界条件(ABC)予以闭合。虽然用于直接求解对象表面电流的积分方程(IE)方法不如FEM通用,但它在解决大型开放问题时往往效率更高,因为它不需要周围的空气体积。通过在FEBI方法中结合这两种方法,HFSS用户能够准确高效地仿真非常复杂的大型开放性问题。HFSS™的13.0版将提供这种新方法。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS


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Design-By-Desense: A Simulation Workflow for an Interference-Free Design of Electronic Devices - White Paper

Modern electronic devices, penetrating every aspect of our lives and impacting many industries such as aerospace and defense, automobile and consumer electronics, are becoming smaller, faster and increasingly more feature-rich and complex. With the rise of the Internet of Things (IoT), the demand for electronic devices with wireless communication capability and smart sensors is growing at a rapid rate. The complexities involved in designing their wireless capabilities necessitate using simulation tools in order to improve their reliability and performance.

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS
Product Category: Electronics - Signal Integrity
Industry: Aerospace and Defense


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集成了Cadence的ANSYS HFSS

用于3-D布局的ANSYS® HFSS™可支持与Cadence®的无缝集成,并为RF工程师、SI工程师和数字工程师提供全新的环境。此功能基于“按需求解器”技术而构建,可让用户在Cadence Allegro®、APD、SIP或Virtuoso等环境中工作的同时设置待求解的芯片、封装或电路板仿真。利用该功能,用户可以在自己熟悉的Cadence环境中工作,同时创建完整的3-D HFSS模型。这种易于使用的功能尤其适用于不熟悉3-D电磁场建模但需要HFSS的精确度与可靠性的工程师。所有必需的HFSS设置步骤(如几何结构、材料性质、端口设置及边界条件)都可以简单、快速地应用于Cadence界面之中。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS
Product Category: Electronics - High Frequency Electromagnetics
Industry: High Tech


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ANSYS HFSS 3-D布局

本应用简介将介绍ANSYS® HFSS™中的3-D布局功能,该软件是用于仿真高频和高速电子组件中3-D全波电磁场的业界标准工具。HFSS除了传统的3-D建模器界面之外,还包含3-D电气布局界面。这种布局界面可让工程师利用平面叠层界面创建更详细、高度精确的HFSS模型。此外,该布局界面还有一个2.5-D力矩法求解器以及用于求解平面几何结构的综合参数化和优化功能。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS
Product Category: Electronics - High Frequency Electromagnetics
Industry: High Tech


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利用3D电磁场仿真工具开展板上封装仿真

多年以来,设计人员在仿真中考虑到了封装寄生参数的影响,从使用理想电感+电阻等简单的一阶模型到更为复杂的Spice梯形网络直至最后使用3D电磁场仿真器完整抽取封装的S参数。对于封装和PCB通道相结合的情况,目前最常用的方法是分别抽取封装和电路板作为S参数模型或宽带SPICE模型,然后在电路仿真器中将这两种模型结合起来。由于工作频率不断升高、信号速度不断加快、集成器件日益复杂等因素,这种方法也暴露出越来越多的局限性。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS
Product Category: Electronics - High Frequency Electromagnetics
Industry: High Tech
Sub Industry: Consumer Electronics


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Energy Efficient, IoT-Based Smart Home - White Paper

"Smart Home" technology is the future of residential technology, designed to deliver and distribute a number of services inside and outside the house via networked devices in which all the different applications and the intelligence behind them are integrated and interconnected. These smart devices have the potential to share information with each other as long as they can access a broadband internet connection. Hence, "Smart Home" technology has become part of the IoT (Internet of Things). In this work, we analyze a home model to demonstrate an energy-efficient IoT-based smart home. We perform multiphysics simulations focusing on the kitchen of the home model, and use a motion sensor with a surveillance camera as part of the home security system. Coupled with the home light and HVAC control systems, the smart system can remotely control the lighting and heating or cooling when an occupant enters or leaves the kitchen.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS
Product Category: Electronics - High Frequency Electromagnetics
Sub Industry: Electrical and Electronics


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Antenna Simulation for Commercial Unmanned Aerial Vehicles and Wireless Networks in a Warehouse Environment - White Paper

Commercial unmanned aerial vehicles (UAVs) show great promise in applications spanning transportation and delivery, entertainment, agriculture, telecommunications and defense. The transportation and delivery industries show great early promise to bring the revolutionary gains of the Industrial Internet of Things (IIOT) to bear on low-cost and efficient package delivery. This white paper explores diverse communications and engineering problems involving commercial UAVs for delivering consumer merchandise, and describes solutions from ANSYS to these manifold problems. 

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, EMIT
Industry: Aerospace and Defense, Automotive, High Tech


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An Integrated Workflow for Simulating Installed Antenna and RF System Performance on Airborne Platforms - White Paper

This paper presents an integrated workflow for simulating installed antenna and radio frequency (RF) system performance on airborne platforms using ANSYS tools. This workflow begins with the challenges of solving diverse electromagnetic problems involving antennas primarily on aircraft. These problems involve electrically small, medium, large and enormous structures. The workflow also extends to the simulation of wideband RF interference (RFI) potential between RF systems connected to the antennas on the aircraft — an electromagnetic phenomenon often called RF Cosite interference, or Cosite RFI.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS
Industry: Aerospace and Defense


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ANSYS HFSS: Design of Experiments inside ANSYS Electronics Desktop - White Paper

Today’s technology trends and market opportunities require greater levels of component integration, which call for smaller, lighter, less expensive and wider-bandwidth products. These products cannot be represented accurately, nor can they be efficiently designed, using black boxes that fail to capture their electrical interactions with the surroundings. ANSYS Electronics Desktop (AEDT) has different EM and circuit solvers to perform simulations for a variety of applications, such as RF and microwave, antennas, signal integrity, end-to-end channel simulation, EMI/EMC, etc.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS DesignXplorer, ANSYS Electronics Desktop
Product Category: Electronics


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Fast-Tracking Advanced Driver Assistance Systems (ADAS) and Autonomous Vehicles Development with Simulation

ADAS and autonomous vehicles will soon be transforming our world. Due to the complexity of this immense engineering challenge, manufacturers now realize producing a reliable autonomous vehicle requires millions of miles of road testing—as onboard computers must be trained, not programmed. A seemingly impossible task.

These same companies also recognize simulation as the only method to test and iterate millions of possible scenarios. Perhaps most impressively, simulation modeling provides greater precision, faster results and significant cost savings.

Download the white paper to learn:

  • Ways of leveraging simulation in autonomous vehicles and ADAS development
  • Simulation examples, benefits and tools
  • A roadmap for simulation implementation

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS Simplorer, ANSYS HFSS, ANSYS SIwave, ANSYS Icepak, ANSYS EKM, ANSYS Mechanical
Industry: Automotive


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