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Taking the Leap to 7nm: Risk or Reward? - Article - ANSYS Advantage - V11 I2

Benefiting from the advances in semiconductor process node improvements is no easy feat. A host of design challenges and risks accompany every new generation of process nodes. The 7nm node is by far the most advanced available today from all leading foundries. This process node fundamentally challenges the basic assumptions on margin-based design. At the same time, it also pushes the boundaries on power and performance benefits that are available to designers. With the 7nm node being the industry driver for the near future, designers are fundamentally rethinking their design implementation strategies using upfront simulations.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors


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Best Practice, Best Product - Article - ANSYS Advantage - V11 I2

Up to 80 percent of the cost of a product’s development is determined by decisions made early in the design process. Digital exploration, or upfront simulation, is the best way to investigate thousands of design options before product costs are locked in. With its widely adopted simulation platform, ANSYS enables every member of the product development team to participate in digital exploration. The result is more innovative products, faster time-to-market and lower development costs.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Simplorer, ANSYS Workbench, ANSYS SpaceClaim, ANSYS ACT, ANSYS Mechanical, ANSYS RMxprt, ANSYS Maxwell, ANSYS SCADE Test, ANSYS SCADE Display, ANSYS AIM
Product Category: Systems, Structures, Multiphysics, Semiconductors, Embedded Software


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Power Retooling for Chips - Article - ANSYS Advantage - V10 I3

In a conventional approach, chip power-consumption analysis begins late in the design flow and occurs typically when the physical design is complete. At this stage, possible changes that can impact power are limited by schedule and cost considerations. AMD used ANSYS PowerArtist to apply a design-for-power approach at an early stage in the design flow, making it possible to reduce power consumption to unprecedented levels.

Author: AMD Type: Article Date:
Product Name: ANSYS PowerArtist
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductor Design


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Designing Supercomputers - Article - ANSYS Advantage - V10 I2

One of the greatest challenges in designing fast, data-intensive supercomputers is providing power to and removing heat from hundreds of thousands of computing cores. Fujitsu uses the ANSYS power and thermal toolset to simulate its next-generation 3-D IC semiconductor designs from before the systems have been fully defined until final signoff. The result is higher performance and fewer design turns.

Author: Fujitsu Limited Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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The Backbone of the IoT - Article - ANSYS Advantage - V10 I2

The rapid growth of the Internet of Things (IoT) is generating a huge increase in internet traffic. Companies that deliver the ultrahigh-speed systems-on-chip (SoCs) for multi-terabit networking equipment must provide the highest level of data integrity while meeting power, performance, bandwidth and cost requirements. The ANSYS semiconductor toolset enables ClariPhy to meet this challenge and deliver SoCs without additional fab spins.

Author: ClariPhy Communications, Inc. Type: Article Date:
Product Name: ANSYS SIwave, ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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Under the Hood - ANSYS Advantage - Article - V10 I1

The electronics in modern automobiles must operate in a high temperature, under-hood environment without sacrificing performance or reliability. The traditional approach to thermal design, which is based on the assumption that the entire integrated circuit (IC) is at a constant temperature, is fast becoming obsolete as higher power dissipation and shrinking form factors make thermal design more critical. NXP engineers use ANSYS tools to calculate temperature and current density throughout the device, making it possible to predict local junction temperatures more accurately and perform thermal-aware electromigration (EM) analysis.

Author: NXP Semiconductors Inc Type: Article Date:
Product Name: ANSYS Icepak, ANSYS Sentinel, ANSYS Totem, ANSYS RedHawk
Product Category: Fluids, Multiphysics, Semiconductors, Electronics - Cooling
Industry: Automotive, High Tech
Sub Industry: Car and Light Truck OEMs


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