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Power Retooling for Chips - Article - ANSYS Advantage - V10 I3

In a conventional approach, chip power-consumption analysis begins late in the design flow and occurs typically when the physical design is complete. At this stage, possible changes that can impact power are limited by schedule and cost considerations. AMD used ANSYS PowerArtist to apply a design-for-power approach at an early stage in the design flow, making it possible to reduce power consumption to unprecedented levels.

Author: AMD Type: Article Date: October 24, 2016
Product Name: ANSYS PowerArtist
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductor Design


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Designing Supercomputers - Article - ANSYS Advantage - V10 I2

One of the greatest challenges in designing fast, data-intensive supercomputers is providing power to and removing heat from hundreds of thousands of computing cores. Fujitsu uses the ANSYS power and thermal toolset to simulate its next-generation 3-D IC semiconductor designs from before the systems have been fully defined until final signoff. The result is higher performance and fewer design turns.

Author: Fujitsu Limited Type: Article Date: June 15, 2016
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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The Backbone of the IoT - Article - ANSYS Advantage - V10 I2

The rapid growth of the Internet of Things (IoT) is generating a huge increase in internet traffic. Companies that deliver the ultrahigh-speed systems-on-chip (SoCs) for multi-terabit networking equipment must provide the highest level of data integrity while meeting power, performance, bandwidth and cost requirements. The ANSYS semiconductor toolset enables ClariPhy to meet this challenge and deliver SoCs without additional fab spins.

Author: ClariPhy Communications, Inc. Type: Article Date: June 14, 2016
Product Name: ANSYS SIwave, ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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Under the Hood - ANSYS Advantage - Article - V10 I1

The electronics in modern automobiles must operate in a high temperature, under-hood environment without sacrificing performance or reliability. The traditional approach to thermal design, which is based on the assumption that the entire integrated circuit (IC) is at a constant temperature, is fast becoming obsolete as higher power dissipation and shrinking form factors make thermal design more critical. NXP engineers use ANSYS tools to calculate temperature and current density throughout the device, making it possible to predict local junction temperatures more accurately and perform thermal-aware electromigration (EM) analysis.

Author: NXP Semiconductors Inc Type: Article Date: March 15, 2016
Product Name: ANSYS Icepak, ANSYS Sentinel, ANSYS Totem, ANSYS RedHawk
Product Category: Fluids, Multiphysics, Semiconductors, Electronics - Cooling
Industry: Automotive, High Tech
Sub Industry: Car and Light Truck OEMs


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