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Physics-based Simulation Solutions for Power Electronics System Development - Webinar

Watch this recorded webinar to learn how you can use ANSYS Simplorer to solve your toughest challenges in designing power electronics systems. The webinar focuses on power losses and thermal design; EMC conducted noise; and analysis of failure modes through fault injection.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Simplorer
Product Category: Electronics


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Physics-Based Simulation Solutions for Power Electronic System Development - Webinar

Physics-based simulation is indispensable in the development of power electronic systems that helps companies reduce development costs, optimize energy efficiency, increase reliability and comply with standards for EMC and safety.

ANSYS provides an extensive and highly integrated set of solutions for modeling and analyzing power electronics, from 3-D physics simulation of critical components to multi-level system simulation of low/medium/high voltage drives, inverters, converters, controls and protection equipment. ANSYS Simplorer uniquely integrates detailed 3-D electromagnetic, electrical and thermal simulations with highly accurate semiconductor devices and VHDL-AMS and Spice components to create power electronic system models that can be virtually tested to analyze and optimize performance.

Learn how ANSYS Simplorer is used in power electronic systems development workflows to simulate and optimize power losses and system efficiency, mitigate EMC problems, understand thermal performance, integrate controls, and inject and assess faults.

 

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Simplorer
Product Category: Electronics


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System Level Chip-Package-System Power Integrity Co-analysis Solutions for 3DICs - Webinar

3DIC design has plenty of technical challenges, from design setup to tape-out, due to its complexity. In particular, seamlessly connecting a power delivery network (PDN) from a voltage regulator module (VRM) through a board, package and interposer to a chip directly impacts the 3DIC performance. A minor error can cause significant performance degradation. Only a fully integrated power integrity analysis solution can predict potential power noise and prevent unexpected performance issues. However, in reality, all components of a 3DIC are implemented in silos, and conventional co-analysis methodologies do not cater to this silo approach.
 
Join us for this webinar in which we will address the technical challenges of 3DIC power integrity analysis and propose a comprehensive CPS-integrated co-analysis solution based on ANSYS products. The proposed solution will include a chip model creation encompassing multiple dies; PDN parasitic extraction of  the interposer, package, and board; seamless connection of all PDN channels; and AC and transient analyses.

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Electronics


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Using ANSYS Totem to Ensure Power and Noise Integrity of High Performance Analog and Mixed-signal Designs - Webinar

Learn why all major semiconductor companies use Totem for sign-off in their production flow to achieve stringent power noise and reliability requirement for their mixed-signal IP, analog and custom-IC designs, and how Totem is the only solution today that can analyse complex mixed-signal blocks containing both analog and digital content.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Totem
Product Category: Electronics
Sub Industry: Semiconductors


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ANSYS in ACTION: Predicting Radio Frequency Interference with ANSYS EMIT

The massive proliferation of wireless devices surrounds us in devices so common — such as smartphones, wearable devices, laptops, sensors and automotive systems — that often we don’t even realize their pervasiveness. With only a finite spectrum in which to operate, the likelihood of these systems interfering with each other and degrading performance of neighboring systems becomes more and more of a problem. The ability to anticipate potential radio frequency interference (RFI) issues that can degrade, or block, system performance is now a critical part of the system level design. View this ANSYS in ACTION webinar where an ANSYS expert will demonstrate the use of ANSYS EMIT for predicting RFI in complex environments.

Author: ANSYS Type: Webinar Date:
Product Name: EMIT
Product Category: Electronics
Sub Industry: Electrical and Electronics


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Acceleration of Design Closure and Sign-Off for 7-nm FinFET Technology - Webinar

Industry-leading chip designers are moving to 7nm FinFET processes to produce chips with increased functionality and performance at a comparable power envelope, while at the same time improving engineering time and reducing cost. However, attaining these benefits isn’t easy — you must also address increasingly complex design issues that affect power integrity and reliability.

Register now for this webinar, where our experts will demonstrate how using the right simulation tools and methodology when designing 7nm FinFET-based chips can address difficult design constraints such as shrinking margins, large design sizes and complex reliability checks.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics
Sub Industry: Electrical and Electronics


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Hardware Simulations for Next Generation Advanced Driver Assistance Systems - Webinar

Sensors, antennas and electronics are the brains behind today's intelligent Advanced Driver Assistance Systems (ADAS). Advances in integrated antenna design, image sensing and integrated circuit design are quickly transforming automotive vehicles into autonomous vehicles. These advances are also helping build cheaper, safer and more intelligent ADAS systems. As the design of these ADAS systems becomes more complex, though, design engineers must rigorously simulate multiple components and systems for functionality, reliability and safety.

Register now for this webinar where our experts will provide a broad overview of antenna design in automotive environments and discuss challenges in chip-package-system integration for ADAS modules.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics
Industry: Automotive


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Ensuring Power & Noise Reliabilty of your High Performance SoCs with ANSYS RedHawk Analysis Software - Webinar

In globally competitive markets for mobile, consumer, automotive and networking, the success of high performance SoCs relies upon power efficiency, performance and reliability. During this webinar you will learn about how ANSYS RedHawk, the most trusted, industry-standard power integrity and reliability solution, enables designers to preserve the integrity of the power delivery network and accurately predict power and noise for the most advanced, high performance SoCs from chip to package to board. We will also demonstrate thermal-aware EM analysis, chip-package-system cosimulation, SoC ESD integrity verification, and timing (clock, critical path) impact analysis.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS RedHawk
Product Category: Electronics


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Simulation of Planar Magnetic Components - Possible or Impossible - Germany - Webinar

Millions of dollars each year are spent generating and transporting thermal energy to achieve thermal goals. Thermal optimization not only improves the economy of transporting energy, maintaining building temperatures, manufacturing processes and products, it improves their efficiency as well. Engineers use simulation to reveal detailed pictures of thermal processes, providing a deep understanding of all aspects of thermal management.

View this Webinar to learn how you can capture thermal processes in powerful simulations, seamlessly identify multiphysics interactions that impact performance, and quickly achieve thermal optimization using integrated design optimization tools.

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Electronics
Industry: Energy


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Herramientas de mallado en CFD



Crear el mallado más adecuado es la base de la simulación en ingeniería.

La fidelidad y la precisión son dos puntos fundamentales para la simulación CFD.

Se pueden reducir, e incluso sustituir por CFD, el prototipado físico y las pruebas solo si se pueden obtener resultados precisos.

Hasta ahora, los resultados de alta fidelidad y alta precisión tenían su precio.

Las geometrías complejas necesitaban horas de efuerzo manual para "limpiar" el modelo y luego preparar el mallado.

Los usuarios podrían haberse visto tentados de tomar atajos para acelerar la preparación, quizás afectando precisión y fidelidad.

En este webinar, se presentarán las principales herramientas de mallado disponibles en ANSYS, enfocando en las principales capacidades de cada herramienta.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics


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