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Electrification: Achieving Next-Level Performance - White Paper

Engineered electrical systems for energy production, distribution and consumption are incredibly complex — and becoming even more sophisticated as their functionality increases. Dramatically improving the efficiency of these systems means relying on engineering simulation to introduce extreme innovation, quickly and cost-effectively.

Author: ANSYS, Inc Type: White Paper Date:
Product Category: Electronics, Embedded Software, Fluids, Structures
Industry: Automotive, Aerospace and Defense, Energy


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Digitalization: Best Practices for Designing Smart, Connected Products and Driving Business Outcomes - White Paper

Products are becoming smarter and more digital every day — creating consumer benefits, but also significant engineering challenges. Simulation offers the only solution for combining extreme innovation with product reliability, speed to market and profitability via cost control.

Author: ANSYS, Inc. Type: White Paper Date:
Product Category: Structures, Electronics, Embedded Software
Industry: Automotive, Healthcare - BioMed, High Tech
Sub Industry: Semiconductors


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ANSYS HFSS: Design of Experiments inside ANSYS Electronics Desktop - White Paper

Today’s technology trends and market opportunities require greater levels of component integration, which call for smaller, lighter, less expensive and wider-bandwidth products. These products cannot be represented accurately, nor can they be efficiently designed, using black boxes that fail to capture their electrical interactions with the surroundings. ANSYS Electronics Desktop (AEDT) has different EM and circuit solvers to perform simulations for a variety of applications, such as RF and microwave, antennas, signal integrity, end-to-end channel simulation, EMI/EMC, etc.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS DesignXplorer, ANSYS Electronics Desktop
Product Category: Electronics


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ANSYS RedHawk - White Paper

With integrated circuits (ICs) driving everything from high-performance computing and communications to automotive, health care and industrial, it is paramount to ensure power integrity and reliability of those ICs. ANSYS RedHawk as Industry’s leading solution for power, noise, and reliability sign-off, and with over 1000s of customer designs in production, offers you the least risk.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS RedHawk
Product Category: Electronics


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Turning Signal Integrity Simulation Inside Out

DesignCon is the premier conference on high-speed electronics at the chip, package and system level. Held annually in the heart of Silicon Valley, it brings together top design engineers, researchers and industry executives who drive the frontier of electronics. At the conference Dr. Zoltan Cendes, the founder of Ansoft Corporation (acquired by ANSYS in 2008) and a Life Fellow of IEEE, delivered a keynote presentation on how signal integrity (SI) simulation has been turned inside out with electromagnetic (EM) field simulation.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS SIwave
Product Category: Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity, Electronics, Electronics - Electromechanical
Sub Industry: Semiconductors


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Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages - White Paper

This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be utilized for all electrical CAD (ECAD) types such as IC packages, touch panel displays, and glass and silicon interposers. The authors followed this reference design flow for analyzing a PCB virtual prototype used in the consumer electronics industry. The design flow details nearly all aspects of the modeling technique from studying electrical connections in a schematic and setting up the PCB to analyzing the electrical, thermal and mechanical characteristics of the board — all using ANSYS tools. The multiphysics simulation yields power losses across the entire board and its objects, determines whether the integrated circuit (IC) and overall board temperatures lie within safe operating limits and predicts overall PCB reliability, taking into account all its components and heat sinks.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS Icepak
Product Category: Electronics, Electronics - Cooling, Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity


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The Internet of Things for Connected Soldiers and Battlefield Security - White Paper

Soldiers must maintain situational awareness at all times for safety and to ensure successful missions. Internet of Things (IoT) technologies provide connectivity between soldiers, sensors and other devices that help achieve these goals. But the battlefield is a harsh radio frequency (RF) environment as radio communications clash with numerous transmitting and receiving systems, and the risk of antenna damage from bomb fragments or bullets endanger the normal functions of these devices. This work examines how simulation can impact the design of devices and antennas and mitigate these environmental conditions.
 

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, EMIT
Product Category: Electronics, Electronics - High Frequency Electromagnetics
Industry: Aerospace and Defense


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Overcoming Thermal Management Challenges with Multiphysics Simulation - White Paper

Designing products, components and systems that can withstand a wide range of thermal scenarios is a design challenge that touches nearly every industry. From automobiles to high-speed semiconductors, thermal management concerns can often lead to wasted energy, reduced performance or premature device failure. This results in increased energy costs, warranty issues and additional design time that can reduce competitive advantage. To master thermal management design and truly understand thermal behavior of a system, streamlined multiphysics simulation tools are a necessity.

Author: Type: White Paper Date:
Product Name: ANSYS Maxwell, ANSYS Mechanical, ANSYS AIM, ANSYS CFD
Product Category: Fluids, Multiphysics, Electronics, Structures, Electronics - Electromechanical


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Shape Optimization for Aerodynamic Efficiency using Adjoint Methods - White Paper

Adjoint solvers take a Computational Fluid Dynamics (CFD) flow solution and calculate the sensitivity of performance indicators (e.g. drag, heat transfer) to all of the design variables. Once an adjoint solution is obtained, the designer has key information on how to alter the shape of the design in order to improve the quantity of interest. Mesh morphing is an easy and powerful tool that allows the geometry to be altered at the mesh level and within the parallel solver in order to evaluate effects of the design alterations. The user may then iterate on this process to achieve an optimum design without the need to return to the original CAD geometry. For complex geometries, the aerodynamic interactions become complex and the insight gained by such an optimization method can take the design in directions which would not be intuitive to follow and difficult to represent using parametric geometry.

Author: Type: White Paper Date:
Product Name: ANSYS Fluent, ANSYS CFD
Product Category: Fluids, Electronics, Systems
Industry: Automotive, Aerospace and Defense


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Why Engineering Simulation is Critical for Breakthrough Energy Innovation - White Paper

Breakthrough Energy Innovation requires ambition and urgency. Developments will come in the areas of renewable energy production and improving energy efficiency in the industrial and transportation sectors. However, many products in these sectors are already highly tuned for their function. Consequently, higher fidelity understanding of product behavior is required to identify additional incremental improvements. For more disruptive innovation, a very wide design trade space becomes necessary as products are often more complex, do not have a history of operational experience, and function in different environments that include design variables outside of the traditional product’s boundaries. To address these challenges, companies are turning to simulation. It’s a solution that allows designers to get deeper insight into product performance and consider hundreds, if not thousands, of design iterations.

Author: Type: White Paper Date:
Product Name: ANSYS Mechanical
Product Category: Fluids, Electronics, Structures, Systems
Industry: Automotive, Aerospace and Defense, Industrial Equipment, Energy


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