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Planar Magnetics Component to System Design - Achieving ...
Planar transformers and inductors are ideal for today’s high density electronics because they have low profile magnetic cores, superior heat dissipation capability, lower leakage inductance and less AC winding. The design of these components, however, is complex and requires a non-intuitive selection of the core. In addition, these components can be a considerable heat source and cause EMC/EMI issues. During this webinar, we examine several planar magnetic device designs at the PCB level. We use ANSYS HFSS and ANSYS Maxwell to demonstrate component-level analysis. This example is based on a push-pull converter with an integrated magnetics component and a silicon MOSFET switching circuit.

Author: ANSYS
Type: Webinar
Date: Mar 27 2015
Product Name: ANSYS HFSS
Product Category: Electronics

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Comment obtenir rapidement des maillages de qualité sur des ...
La modélisation en CFD de systèmes de plus en plus complexes nécessite de disposer d’outils performants pour obtenir rapidement des maillages de qualité. ANSYS Fluent Meshing répond à ce besoin en proposant un ensemble d’outils appropriés à la gestion de géométries complexes. Ces approches sont utiles pour des industries aussi diverses que le biomédical, l’automobile, l’aéronautique ou le pétrole. En version 16, ANSYS Fluent Meshing intègre une arborescence, facilitant l’utilisation des contrôles disponibles, que ce soit : la définition du maillage par size functions, les outils de wrapping, la possibilité de combiner plusieurs maillages ou bien encore l’automatisation par script. ANSYS Fluent Meshing vous permet de travailler directement à partir d’une géométrie classique ou facétisée, ou bien encore d’un maillage préexistant. Ce webinar présentera le cadre d’utilisation de ANSYS Fluent Meshing en version 16, les fonctionnalités et approches qu’il offre ainsi que des illustrations de sa mise en œuvre.

Author: ANSYS
Type: Webinar
Date: Mar 26 2015

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ANSYS SpaceClaim Direct Modeler - Brochure

Page 1. ANSYS SpaceClaim Direct Modeler Faster Time to Analysis Open ... the design process. ANSYS simulation technology enables you to predict with confidence that your products will thrive in the real world. Customers trust ...

Type: Brochure
Date: Mar 26 2015
Product Name: ANSYS SpaceClaim Direct Modeler
Product Category: Other

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2014 Global Simulation Market for Discrete Industries Product Leadership Award - White Paper

... 8 Best Practice Award Analysis for ANSYS, Inc. .... 8 ... atch to Needs eliability and Quality oduct/Service Value nancial Performance ustomer Acquisition perational Efficiency rowth Potential uman Capital Analysis for ANSYS Scorecard ...

Author: a_torres
Type: White Paper
Date: Mar 26 2015

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Calculs dynamiques des structures immergées ou contenant ...
La prise en compte de l'effet de masse ajoutée est primordiale dans la conception de structures immergées ou contenant un fluide. Ces situations sont fréquemment rencontrées dans les industries pétrolières, du transport ou de l'énergie. Ce webinar présente les capacités de modélisation d'un fluide dans le module ANSYS Mechanical pour mesurer l'effet de celui-ci sur le comportement dynamique en termes de modes et fréquences propres. L'intérêt de cette approche est d'éviter un couplage bidirectionnel entre des simulations en mécanique des fluides et de structure. Différentes hypothèses de modélisation et de solutions seront détaillées. La comparaison de différents résultats sera également abordée.

Author: ANSYS
Type: Webinar
Date: Mar 26 2015

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Accessible and Affordable Engineering Simulation for ...
ANSYS now provides multiphysics campus-wide solution (cws) for academia. ANSYS is providing more value than ever before--in terms of the amount & breadth of software to engineering schools. Schools can now stretch their dollars much further & ensure greater access to all on campus. Academic IT/HPC directors, deans & professors can learn about campus-wide solution through this video.

Author: ANSYS, Inc.
Type: Video
Date: Mar 24 2015
Product Name: ANSYS SpaceClaim Direct Modeler

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Save Money and Maximize Performance with ANSYS ...
ANSYS and Intel® teamed to optimize ANSYS Mechanical for the latest Intel processor and coprocessor innovations. Based on these efforts, both the Windows and Linux versions of ANSYS Mechanical 16.0 (including the SMP and DMP versions of each) can now utilize one or more Intel Xeon Phi coprocessors. With Intel's special promotion and ANSYS HPC Workgroups, you can take advantage of Intel coprocessor performance within your qualified existing hardware at a significantly discounted price. We will show you how ANSYS Mechanical 16.0 can benefit from the latest generation of Intel Xeon E5 v3 processors and also how to upgrade to these processors, along with the Xeon Phi coprocessors, for spectacular sparse solver performance.

Author: ANSYS
Type: Webinar
Date: Mar 20 2015
Product Name: ANSYS Mechanical
Product Category: High Performance Computing

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Faster Time to Analysis with SpaceClaim Direct Modeler ...
ANSYS SpaceClaim Direct Modeler (SCDM) is the easiest and fastest solution to prepare geometry for simulation. SCDM’s 3D modeling software speeds up time to analysis by removing the geometry bottleneck, and it shortens the time needed for analysis by allowing engineers to simplify models during pre-processing. SpaceClaim Direct Modeler also provides a CAD neutral environment, freeing engineers to focus on the physics and modeling instead of the technology. In this video, we highlight all the new features and functionality for simulation in our 2015 release.

Author: ANSYS, Inc.
Type: Video
Date: Mar 18 2015
Product Name: ANSYS SpaceClaim Direct Modeler

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ANSYS Introduces New Electronics Desktop with 3-D EM ...
Designers must account for electromagnetic (EM) coupling and parasitic behavior resulting from close proximity to other structures to accurately simulate the real-world performance of highly integrated devices. While high-frequency and high-speed designers have addressed for some time this need with electromagnetic simulation, an IP-protected, electromagnetic-aware “black box did not exist. Developing future wireless technologies also requires that multi-disciplinary engineering teams are able to share physics-based models in complex systems, all while addressing electrical, thermal and mechanical requirements in a collaborative workflow. To address these needs, ANSYS 16.0 delivers an all new ANSYS Electronics Desktop featuring ANSYS HFSS and the industry’s first 3-D EM component library. During this webinar, we will introduce you to features in the desktop and illustrate how engineers and CAD support teams can use the new 3-D EM component library. This library can be coupled with IP-protecting encryption to share HFSS components between design teams and across high-frequency supply chains to expedite communication system integration.

Author: ANSYS
Type: Webinar
Date: Mar 13 2015
Product Category: Electronics

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Addressing Engineering Challenges in Antenna Integration ...
The radiation characteristics of antennas and phased array systems are strongly altered when they operate in a complex environment. For antennas mounted on large platforms such as satellites, planes or vehicles, the radiation characteristics are influenced by complex elements close to the antenna, as well as by the platform itself. For these reasons, antennas mounted on complex structures must be analyzed in their complete integration environment. During this webinar, we will present comprehensive ANSYS HFSS applications to demonstrate how a multi-domain, multiphysics methodology predicts airborne antenna radiation and the diffraction of large targets. Special consideration will be made to introduce comprehensive multi-physics and complete system modeling in the study of real-life behavior for an antenna integrated into a complex structure, thereby ensuring large gains in accuracy and reduced computing time in the parametric study phase on large objects. This presentation will discuss how multiple domains in ANSYS HFSS solver technology address large variations in electrical size and scale, and geometric complexity. A real-world example based on a helicopter mounted antenna will demonstrate the challenges of addressing a mutual electromagnetics/fluid flow problem.

Author: ANSYS, Inc.
Type: Webinar
Date: Mar 13 2015
Product Name: ANSYS HFSS
Product Category: Electronics

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