 | From Dimensions of Electronic Design Seminar, 2012:
New computational techniques will be introduced for enhancing the modeling capabilities of finite phased antenna arrays. Creating tapered or sparse finite array element configurations is a snap in ANSYS HFSS 15.0. Solve times may be reduced by several orders of magnitude when only a subset of scan vectors is required or sped up significantly for an array desiring full scan information. Pattern accuracy is enhanced with a new numerical absorbing boundary that is effective at all scan angles. Comparisons of finite array DDM and explicit models will be shown. Finally, guidance will be given about optimal hardware/software setup to tackle phased array modeling. | View Now (PDF) Add to briefcase |
| | From Dimensions of Electronic Design Seminar, 2012:
This presentation demonstrates how large microwave circuits can be created and simulated using the HFSS for ECAD layout interface. This new user interface combines a layout editor-based drawing tool with a new streamlined, single click port creation capability, as well as automated air region creation and boundary assignments. We will show how these new capabilities substantially decrease the amount of effort required to create extremely large and highly complex microwave circuits. Additionally, we will showcase how this new design flow is further enhanced by allowing users to easily and quickly include lumped elements or S-parameter models in an HFSS simulation. Since large scale microwave circuits often include large numbers of vias and/or bondwires, we will also discuss how the new release of HFSS can be used to efficiently handle high via and/or bondwire counts. | View Now (PDF) Add to briefcase |
| | From Dimensions of Electronic Design Seminar, 2012:
Signal and Power Integrity and EMI/ESD are challenging areas in electronics design and can be the most limiting factor in successful product launches. With exceptionally short design cycle life times for today’s modern electronics, system simulation driven product development has become more important than ever. With the release ANSYS R14.5 there is a new set of advanced rigorous simulation techniques implemented for simulating SI/PI and ESD/EMI design challenges. In this presentation we will present a detailed overview of ANSYS SIwave 7 with a chip-package-system (CPS) flow. It will also include an overview of the new user interface for ANSYS AnsoftLinks, for automated 3D simulation using ANSYS HFSS, and newly integrated prism-based Apache PSI full-wave solver. New capabilities and improvements in ANSYS DesignerSI 8 and HFSS 15.0 for signal and power integrity and EMI/ESD will also be shown. | View Now (PDF) Add to briefcase |
| | From Dimensions of Electronic Design Seminar, 2012:
Predicting today’s memory interfaces is of great importance for many companies that design modern electronics systems. The most common need is an automated and accurate physical extraction of memory channel components and overall system compliance verification of memory interface modules. Using ANSYS SIwave and ANSYS DesignerSI automated capabilities, engineers are enabled to simulate physical behavior of memory channels and verify performance against strict DDR3 electrical standards. ANSYS User Defined Solutions allow calculations and post-processing of raw transient simulation data, which creates User Defined Documents containing detailed information about AC data timing calculations such as setup and hold times, eye diagrams due to the strobe crossing, de-rating including a support for non-ideal voltages for every bit-by-bit falling and rising transition edge. | View Now (PDF) Add to briefcase |
| | From Dimensions of Electronic Design Seminar, 2012:
Low-power ICs are becoming increasingly complex, often surpassing Moore's Law to maintain expanded functionality and performance needs. To achieve higher integration and bandwidth, designers are turning to stacked-die or 3D-IC structures. These designs leverage ultra-low sub-1V supply voltage levels; they also use on-chip voltage regulators (LDO) to meet power budget and performance goals. This presentation focuses on Apache's latest generation of the RedHawk platform — RedHawk-3DX — with direct support for multi-die simulation, including a new multi-pane, multi-canvas graphical user interface, hierarchical dynamic simulation capabilities, new logic and activity propagation engines, and the ability to model and simulate LDOs. RedHawk-3DX will help enable the next generation of 3GHz+ ICs designed using billions of gates in complex 3-D/2.5-D architectures. | View Now (PDF) Add to briefcase |
 | In this webinar we provide an overview and demonstration of the graphical user interface for ANSYS ALinks for ECAD (formerly AnsoftLinks). The new interface leverages our popular SIwave interface and provides greater flexibility when modifying imported ECAD geometry and delivers a single platform for engineers to prepare package and PCB ECAD date for electromagnetics simulation. Run Time - 55 minutes | Add to briefcase Download Now |
| | Are you feeling constrained by hardware when trying to reach the required fidelity of your CFD simulations within an acceptable amount of time? Do you also want to account for larger size models, more geometric detail, and more complex physics (like LES) than what is currently solvable in your (already) high-end compute environment?
CFD models of over 100 million cells are now increasingly common, and models of over a billion cells are emerging. To meet the demand for 10 to 100 times larger models the simulations will have to scale to 10 to 100 times more cores. Hence, the “capability” of the compute environment must be enhanced, not just the “capacity”.
This webinar will review the efforts by Cray, Inc. and ANSYS, Inc. to scale production models to thousands of cores and provide the overall compute environment required to take CFD simulations to the next level of extreme fidelity. Run Time - 42 minutes | Add to briefcase Download Now |
| | In this webinar, you will learn about the new electronics cooling capabilities offered with ANSYS release 14.5. The update will include a presentation on the improvements in usability for electronics cooling, and new advanced thermal modeling capabilities for IC packages and printed circuit boards. During this presentation, you will also learn about innovations in multiphysics coupling of electromagnetics and thermal simulation for increasing the fidelity of electronic designs. Run Time - 48 minutes | Add to briefcase Download Now |
| | A typical simulation workflow requires reading geometry, cleaning it, creating a closed body, generating mesh and reviewing mesh quality. For having a hex dominant mesh, additional geometry decomposition steps may be required. This process can be tedious.
In ANSYS 14.5, there are host of new features in ANSYS DesignModeler (DM) and ANSYS Meshing (AM) that makes preprocessing faster, more efficient and hence resulting in improved productivity for CFD and Mechanical workflows. These enhancements include support of newer CAD releases, usability for DM and AM, improved performance while dealing with large sized CAD geometry and hex dominant mesh in AM.
In this webinar, we will introduce the new features and also scenarios where these can be used. In addition we will discuss tips & tricks and demonstrate the advantages of using new usability features which improves user efficiency and speed. Run Time - 55 Minutes | Add to briefcase Download Now |
| | This webinar will provide an overview of the many enhancements available in HFSS. Advanced solving methods in HFSS at ANSYS at release 14.5 include a faster and more scalable direct matrix solver, improved finite antenna array analysis with domain decomposition and advanced mixed order solutions. Hybrid solving methods have been improved with the notable addition of conductor coupling between finite element and method of moment domains. In addition, HFSS at R14.5 includes extended antenna array simulation capabilities including arbitrary array mask, composite excitations and more. These enhancements will allow HFSS to remain the gold standard in accuracy and ensure that you can solve the largest most challenging electromagnetic simulations in the shortest amount of time. Run Time - 1:15:00 | Add to briefcase Download Now |