Ask the Expert – Different Methodologies of Modeling IC Packages in Ansys Icepak 13.0
Avoiding high temperatures in IC packages and ensuring reliability of the associated system is key to a successful package design. Increasing complexity and power dissipation of electronic designs, along with the reduction of the chip sizes and increased power densities makes thermal analysis even more critical. Thermal analysis of IC packages predict the temperature distribution within the IC package and play a critical role in the IC package design. Thermal analysis of IC packages can be done with different modeling aims, e.g.,, package viability/selection, package to PCB heat spreading, heat sink design, board layout, system flow and thermal design, etc. ANSYS Icepak offers a variety of methods to model IC packages depending on the final aim of the thermal analysis. These methods ranges from detailed thermal models for characterization or customization of the packages to use of compact conduction models, DELPHI network models, low conductivity blocks, resistance network models, etc. This presentation will help ANSYS Icepak users capitalize on the different techniques available for modeling IC packages in thermal simulations. Applicability of each modeling method pertaining to different modeling goals will be discussed.