Integrating CAE Tools: a Package Deal
Moldex3D and ANSYS Mechanical team up to simulate microchip encapsulation. Despite recent trends in copper internal heat spreaders, a significant fraction of ICs are encapsulated by plastic, a process that is usually accomplished by transfer molding.Through the coupling of Moldex3D® from Coretech System Co. and ANSYS Mechanical simulation software, engineers can analyze the complicated physical phenomena inherent in the encapsulation process and further optimize the package design. The nonlinear capability of ANSYS Mechanical technology is critical.
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