Systems & Multiphysics Solutions Features
Recent advancements in the engineering simulation ecosystem enable a total systems approach to product design and engineering. A “perfect storm” of technology development — including analysis software, hardware and high-performance computing (HPC) — places systems-level simulation within easy grasp of today’s engineers. This technology allows you to focus on the parametric definition of a product’s functional specification, prior to providing detailed descriptions that might constrain system greatness. By simulating an entire product system early in the design cycle, in a virtual environment that replicates real-word conditions, manufacturers can address the most likely sources of system failure before those sources are locked into the design.
Systems-level simulation requires exacting technology standards as well as incredible scale and speed. This calls for enormous breadth and depth in structural, fluidic, electromagnetic and thermal physics. ANSYS brings industry-standard multiphysics capabilities — combined with our expertise in data and process management, reduced-order modeling and cosimulation, application integration, and computational power — for systems-level analysis via a single, easy-to-use technology platform.
Product differentiation increasingly depends on embedded software that controls a product system's reliable performance, including complex control code and user-friendly human–machine interfaces. All this furthers product complexity and risk. With the acquisition of Esterel Technologies' embedded software modeling and simulation solutions, ANSYS is creating a robust product development platform that simultaneously considers the complex interactions of hardware, software and control electronics. With these solutions, engineers can gain critical insights earlier in the system and software design processes — and link the predicted behavior to specific customer requirements.
Loading Content. Please wait
Multiphysics technology from ANSYS is built on proven solver technology validated by many years of application by the world’s leading universities and corporations. Technical depth and breadth in all physics — structural mechanics, heat transfer, fluid flow and electromagnetics, even down to the chip level — is essential to understanding the complex interactions among different physics disciplines. This industry-leading solver technology for all physics disciplines, in conjunction with the engineered scalability of the ANSYS product portfolio, enables users to solve challenging, real-world multiphysics problems.
The ANSYS Workbench platform is a powerful multi-domain simulation environment that harnesses the core physics from ANSYS, enables physics interoperability and provides common tools for interfacing with CAD, repairing geometry, creating meshes and post-processing results. An innovative project schematic view ties together the entire simulation process, guiding the user through complex multiphysics analyses with drag-and-drop simplicity.
HPC is a strategic enabler for customers who want to increase the value they derive from engineering simulation. It enables high-fidelity simulation (bigger, more detailed, more accurate, more complete systems-level simulation), which is critical for organizations that want to leverage simulation to support product innovation. As problem sizes and complexities increase with systems and multiphysics focus, best-in-class solver technologies from all physics disciplines must work together to solve the complete simulation.
ANSYS HPC solutions enable you to increase the number of design variations you can compute in a given period, leading to better, more optimized products — which you can launch in the marketplace in a shorter time frame.
ANSYS partners with leading hardware vendors to ensure that customers get the coordinated expert support they need.
Good design starts with identifying the relationship between performance and design variables. ANSYS design exploration tools enable engineers to perform design of experiments (DOE) analyses, investigate response surfaces and analyze input constraints in pursuit of optimal design candidates.
The solution to managing complex processes and the resulting CAE data explosion is an end-to-end support system designed with a special focus on scale, scope and purpose. ANSYS Engineering Knowledge Manager (EKM) supports the seamless sharing of product specifications, performance metrics and other critical engineering insights — so that the entire team, even when dispersed across multiple time zones and geographies, is equipped with the same reliable, real-time information at both component and system levels.
Multiphysics technology from ANSYS delivers two proven solution techniques to solve multiphysics problems: direct coupled-field elements and the ANSYS multi-field solver. These approaches provide flexible simulation methods to solve a broad range of both direct and sequentially coupled multiphysics problems, such as induction heating, electrostatic actuation, Joule heating and fluid–structure interaction (FSI).
Model courtesy WEG Electrical Equipment.
Direct Coupled-Field Elements
Direct coupled-field elements allow users to solve a coupled-physics problem by employing a single finite element model with the appropriate coupled-physics options set within the element itself. A direct coupled-field solution simplifies the modeling of multiphysics problems by allowing users to create, solve and post-process a single analysis model for a wide variety of coupled-field problems. Capabilities include thermoelasticity, piezoelectricity, piezoresistivity, piezocaloric effect, Coriolis effect, electroelasticity, thermoelectricity and thermal–electric–structural coupling.
ANSYS Multi-Field Solver
The ANSYS multi-field solver enables users to solve multiphysics problems by employing automated implicit sequential coupling, which couples multiple single-physics models in one unified simulation. The ANSYS multi-field solver employs robust, iterative coupling in which each physics discipline is solved sequentially and convergence is obtained between the individual disciplines at each time point during the solution. The multi-field coupling is based on customized interprocess communication technology, and no third-party coupling software is required. Coupling capabilities include thermal–structural, thermal–electric, thermal–electric–structural, electromagnetic–structural, electromagnetic–thermal, electrostatic–structural, thermal–electric–fluid, fluid–thermal and fluid–structure interaction.
Native, bidirectional CAD connectivity and automatic meshing with advanced options are provided through the ANSYS Workbench platform. This environment connects with major CAD systems and allows import from most neutral geometry formats.
ANSYS Workbench also provides a wide range of highly robust and automated physics-based meshing tools, including tetrahedral, pure hexahedral, mixed hex/tet/pyramid, inflation layers and high-quality surface meshes. Users have the ability to control many advanced meshing options such as body, surface or edge sizing controls, sphere of influence, inflation layer meshing, mesh defeaturing tolerances, and much more.
Coupling between physics can be entirely automated if the same engineer performs all the different simulations. However, this is not often the case, as structural analysts may not be experts in CFD, or electrical engineers may not be versed in structural analysis. In such cases, data is simply exchanged among engineers in the form of text files defining point clouds. But mapping data between physics is a painful process without the right tools. The ANSYS Workbench platform allows a seamless data transfer from one physics area to another, and it automates the mapping between dissimilar meshes. Workbench easily imports data from external sources, such as point clouds, and maps them onto your current structure. You can modify scaling, units and orientations to match the point cloud data to your model. Visual quality controls check the accuracy of the mapped data. As a result, engineers can quickly map data accurately.