SIwave Interface

ANSYS Icepak provides a link with SIwave software to account for heating due to copper resistive losses in printed circuit boards and packages. SIwave allows performance of complete signal- and power-integrity analyses from DC to beyond 10 Gb/s. The connection permits importing the DC power distribution profile from SIwave into ANSYS Icepak for thermal analysis. The coupling also enables prediction of both internal temperatures and accurate component junction temperatures.

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DC voltage drop simulation with SIwave (left), exported power map (center) and resultant temperatures in PCB (right) including copper resistive losses