Icepak Objects

ANSYS Icepak software contains many productivity-enhancement features that enable quick creation and simulation of electronics cooling models of integrated circuit (IC) packages, printed circuit boards and complete electronic systems. 

Models are created by simply dragging and dropping icons of predefined objects — including cabinets, fans, packages, circuit boards, vents and heat sinks — to create models of complete electronic systems. These smart objects capture geometric information, material properties, meshing parameters and boundary conditions — all of which can be parametric for performing sensitivity studies and optimizing designs.

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ANSYS Icepak objects enable rapid model creation of electronics cooling models.