Automated DELPHI Package Characterization

ANSYS Icepak contains an automated procedure for DELPHI package characterization from a detailed package model. The software runs different boundary condition scenarios to obtain temperature and heat flux values, which are used to create an optimized thermal network model. The optimized DELPHI network model can easily be included in a system-level simulation, which allows accurate prediction of junction temperatures of IC components in a system-level thermal simulation.

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DELPHI package characterization of BGA package: detailed model (left), DELPHI network model (right)