Automated Computation of Thermal Conductivity

Based on imported ECAD data, ANSYS Icepak software can extract detailed thermal conductivity maps for printed circuit boards and packages. For printed circuit boards, localized orthotropic thermal conductivity can be determined from the electronic trace and via information for the printed circuit board layers. This enables accurate representation of thermal conduction in the board, which provides increased fidelity in predicting internal temperatures and component junction temperatures.

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Orthotropic thermal conductivity determined from trace and via information for bottom layer of BGA package substrate