ECAD Handling

      • Stackup editor with export/import
  • Surface roughness setup
  • Trapezoidal etching
  • Signal net dielectric fill definitions
  • Frequency-dependent dielectric materials
  • Material database

Padstack editor

  • Ability to merge build up vias from package designs
  • Via plating (solid, absolute or plating percentage)
  • Polygon, oval, circular, square …

Bondwires

  • Support for multiple bondwire types on a single layer
  • Drawing utility for bondwires

Solderball and solderbump simplified setup

  • .mdl import

ODB++ support improvements

  • Automatic component import for Mentor Expedition EE7.9.2
  • Automatic stackup import for Mentor Expedition EE7.9.4
  • ODB++ component import managerAbility to merge build up vias from package designs

Cadence material import