Design Flow Integration

ANSYS TPA integrates directly into electronic package layout tools, such as Cadence Advanced Package Designer (APD), Mentor Graphics Expedition, Sigrity UPD and Zuken CR-5000, to provide package engineers with a seamless design flow, automatically generating RLC models. The resulting electrical models can then be exported to and analyzed within ANSYS DesignerSI or other SPICE-compatible circuit tools.