Automated RLC ExtractionTPA fully characterizes an entire package structure and automatically produces lumped or distributed RLC (resistance, inductance and capacitance) values for any lead or coupled groups of leads in matrix or SPICE sub-circuit formats. These models can be generated directly from package layout tools — including Cadence, Mentor Graphics, Sigrity and Zuken — and exported into existing SPICE tools (SPICE/IBIS format) for subsequent timing analyses.
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