HFSS Solver on Demand
HFSS Solver on Demand technology enables users to drive HFSS directly from the intuitive stack-up based layout interface of Ansoft Designer. It is an ideal design flow for Electrical CAD (ECAD) import, drawing, and parameterization of electromagnetic designs. This interface is for those engineers who want the 3D rigor, accuracy and reliability of HFSS from a familiar 2D layout based design. With Solver on Demand technology, the HFSS modeling, material properties, port set-up and boundary conditions are set automatically though the Ansoft Designer layout interface. Models of RFIC layout, IC Packages, and Printed Circuit Boards from Cadence Design Systems, Mentor Graphics, and Zuken can be imported directly to Ansoft Designer and solved in HFSS without any further set-up. The package layout can be parameterized to compute tuning and sensitivity to understand impedance variations due to process. The Ansoft Designer design interface supports traditional ECAD primitives such as padstacks, traces, wirebonds, and solderballs and propels a new state of the art solution for digital and RF engineers.
HSPICE Solver on Demand
Ansoft Designer now incorporates Synopsys® HSPICE® as a Solver on Demand technology. Engineers now have a design platform where the best-in-class electromagnetic field solver technology, HFSS, Q3D Extractor, SIwave and the gold standard transient circuit simulator HSPICE can operate from a single E-CAD interface. This results in the Gold Standard design platform for signal- and power- integrity analysis. With Ansoft Designer at the core of this platform high-speed component designers can analyze 3D EM behavior of advanced electronic systems, including gigabit communications channels and high-speed wireless systems. Users can combine s-parameters, w-elements, HSPICE, HSPICE encrypted, IBIS and IBIS-AMI models directly as schematic components allowing them to seamlessly integrate with behavioral, circuit and GHz-accurate interconnect models in unified schematic desktop.
The Ansoft Designer platform supports HSPICE and the Nexxim® circuit simulation technology providing access to multiple signal integrity simulation methods such as traditional transient, fast convolution, statistical and IBIS-AMI analyses. These methods utilize optimization algorithms, Design of Experiments (DoE), tuning and post-processing for key signal and power integrity metrics, such as TDR (time-domain reflectometry), BER (bit-error-rate), timing analysis and eye diagrams. High-speed electronic component designers now have a streamlined, automated design flow where rigorous electromagnetic and circuit analysis can be performed to identify and solve signal and power integrity and EMI problems early in the design cycle.