ANSYS Icepak software enables detailed conduction, convection and radiation analysis on various package types, including impact of trace layout on thermal design. Joule heating data can be imported following an SI/PI simulation with the SIwave product. Engineers can optimize via design using ANSYS tools, identifying and resolving the effects of coating and underfill materials. Due to its adaptive architecture, the ANSYS suite interfaces with select industry partners’ tools, enabling integrated solutions that extend the functionality and efficiency of the simulation process. Relative to the semiconductor industry, ANSYS Icepak can import variable die power data from partner die-level design tools.