ANSYS Mechanical technology can be used to predict thermal, mechanical and moisture-driven stress and strain in a variety of package types. Semiconductor analysis with ANSYS tools often incorporates nonlinear behaviors, including package warpage, solder joint creep, fracture in through-silicon-via designs, fatigue and delimitation. ANSYS capabilities offer the ability to conduct drop and vibration analyses.

Stress analysis of Multi chip module using ANSYS Mechanical

Courtesy of PADT.