Thermal Management

For thermal management, ANSYS Icepak software provides system-level CFD simulation including conduction, radiation, and natural and forced-air cooling. Typical applications include cooling power electronics components, such as IGBTs and MOSFETs, controlling PCB cooling, and selecting/locating fans and heat sinks. Design engineers choose ANSYS FLUENT software for water cooling applications and fluid flow and heat transfer analysis on geometrically complex systems.

Thermal management of power devices using ANSYS Icepak