Thermal Management
For thermal management, ANSYS Icepak software provides system-level CFD simulation including conduction, radiation, and natural and forced-air cooling. Typical applications include cooling power electronics components, such as IGBTs and MOSFETs, controlling PCB cooling, and selecting/locating fans and heat sinks. Design engineers choose ANSYS FLUENT software for water cooling applications and fluid flow and heat transfer analysis on geometrically complex systems.
 |
|
Thermal management of power devices using ANSYS Icepak
|
