Networking & Communications

The networking and communications equipment sector develops products including telecom routers and switches, optical networking devices, firewall devices and mobile phone base stations. Engineers face a variety of challenges in thermal, mechanical and electromagnetic disciplines: a continuous increase in component power density, the drive for miniaturization, and reliance on forced-air cooling as the main method of thermal management. Data center thermal challenges extend even further, with the need to manage heat generated by hundreds of servers or telecommunication routers and switches in a confined space. Because of strict electromagnetic emission regulations, engineers must optimize both the system's thermal management and the system's overall electromagnetic emissions. All these challenges exist within a highly competitive industry landscape, with an overall push to reduce power consumption.


Far field 3D radiation pattern superimposed on finite size multi element array

In addressing such thermal design, mechanical reliability and electromagnetic compatibility issues, product developers require physics depth and breadth. ANSYS provides unparalleled capabilities in its product suite, which enables innovation in networking and communication electronics design. The accuracy of the ANSYS solution reduces design uncertainty and the need for extensive testing. Productivity advancements enable organizations to shorten the product design cycle as well as reduce development and manufacturing costs.


Electric field pattern around satellite with multi element array

ANSYS offers networking and communication equipment designers a variety of engineering simulation tools to address networking and communications product design.

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Mechanical Mechanical

Multiphysics tools from ANSYS enable product designers to examine thermomechanical stresses in packages and boards that develop during thermal cycling. ANSYS Mechanical and ANSYS Structural products assist in identifying stresses that develop during the standard mechanical loading of telecom enclosures. In addition, the capabilities can simulate product mechanical reliability by through vibration and drop test analysis.

Thermomechanical analysis on heat sink, BGA and PCB assembly using ANSYS Mechanical

Electromagnetic Electromagnetic

For electromagnetic simulations, ANSYS products — including HFSS, SIwave, Q3D Extractor and Designer help engineers model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance networking and communication equipment. Engineers utilize ANSYS tools to examine signal integrity and crosstalk between different components — on a single board or between multiple printed circuit boards. ANSYS electromagnetic products are used to design antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs used in wireless communication systems.

 

HF electromagnetic analysis on electronic component using ANSYS Multiphysics

Thermal Management Thermal Management

Thermal management simulation products such as ANSYS Icepak include capabilities for system-level CFD simulation, including forced-air cooling, fan selection and placement, and heat sink and plenum design. Other software from ANSYS accurately and easily models airflow, heat transfer and contaminant transport in ventilation systems. It is useful in data center optimizing equipment layout to meet cooling requirements.

Thermal management of telecom router using ANSYS Icepak

Power Management Power Management

Rapid growth in mobile applications demands higher bandwidth and greater flexibility from the networking and communications equipment infrastructure. These applications demand collection and dissemination of huge amounts of data, rapidly and seamlessly, to support on-demand self-service network access, location-independent resource pooling, and pay-per-use capabilities for mass consumption. To successfully sustain this activity, tremendous amounts of energy are needed for redundant backups, environmental controls and security devices. Networking and communications equipment uses multicore processors to maintain optimal performance while managing overall power consumption. Power delivery network (PDN) integrity issues can contribute to degraded performance, especially when there is a reduction in supplied power. Therefore, ensuring PDN quality is critical to achieving required performance within the defined power envelope.

RedHawk, a full-chip power integrity and signoff platform from ANSYS subsidiary Apache Design, provides a hierarchical extraction methodology and transient simulation engine, delivering the capacity to simulate the entire multicore system on chip (SoC). The technology delivers up to 40 percent speed improvement without sacrificing signoff accuracy. RedHawk-3DX meets the accuracy and capacity demands of sub-20 nanometer process technology; it supports advanced design extraction and electromigration modeling along with enhanced logic handling for greater signoff coverage.  RedHawk is silicon-proven with thousands of successful tape-outs by leading semiconductor and fabless semiconductor companies.