The challenges of managing size, weight and power (SWaP) requirements for next-generation aircraft poses design challenges such as power consumption optimization, thermal management and fail-proof reliability for integrated circuit (IC) designers. Since power determines the size and weight of energy storage or generation solutions— in addition to the system’s endurance under operating conditions — R&D teams must understand and manage power issues early in the design phase. This results in a power-efficient system that provides mission time extension or allows miniaturization of the unit to increase its application profile.
To help ensure optimal power savings and avoid unnecessary chip power consumption that can lead to premature depletion of battery power sources or cause electrical and thermal reliability issues, ANSYS offers industry-leading solutions for advanced aerospace and defense chip design applications. Subsidiary Apache Design’s PowerArtist, a register transfer language (RTL) power analysis and optimization platform, can identify improvements at the RTL level to reduce power consumption without changing system functionality. RedHawk, our full-chip power integrity and sign-off platform, considers the system environment by including an electrical model of the package and board that is generated by ANSYS extraction software. The accurate results from RedHawk’s analysis permit thorough optimization of the IC packaging solution.
Advanced military electronic systems that combine numerous electronic components in very limited space are inherently prone to electromagnetic interference (EMI). These high-density components and their integration with highly sensitive sensory systems make EMI solutions challenging. The RedHawk power and noise analysis tool has the capability to analyze component activity and simulate the electromagnetic excitation it causes. Then Sentinel, a complete chip-package-system (CPS) codesign/coanalysis solution addressing system-level power integrity, thermal and EMI challenges, utilizes the excitation data to simulate the impact of EMI on the package and system environment.
As electronic components consume power, they also generate heat that must be removed to avoid overheating and loss of reliable operation. Sentinel-TI provides an integrated die/package/board thermal and thermal/mechanical stress analysis solution that addresses this critical design issue. Its unique capability to employ a chip thermal model (CTM) from RedHawk and provide on-die temperature variations in very fine resolution, along with layer-by-layer temperature profiles, enables deeper insight into the impact of system-wide temperature on the IC’s electromigration and leakage power for advanced thermal management and reliability.