Multiphysics tools from ANSYS enable product designers to examine thermomechanical stresses in packages and boards that develop during thermal cycling. ANSYS Mechanical and ANSYS Structural products assist in identifying stresses that develop during the standard mechanical loading of telecom enclosures. In addition, the capabilities can simulate product mechanical reliability by through vibration and drop test analysis.

Thermomechanical analysis on heat sink, BGA and PCB assembly using ANSYS Mechanical