Thermal Management

For thermal management of avionics systems and airborne electronics, ANSYS Icepak offers the ability to perform CFD simulation related to natural and forced convection and radiation heat transfer. Joule heating effects in package or board substrates can be incorporated into a design analysis through direct import from ASYS SIwave, our SI/PI product with power integrity simulation capabilities. For radar or antenna applications, the heat load generated during operation can be incorporated into the thermal design through direct import of heat load data from the 3-D high frequency electromagnetic simulation tool, ANSYS HFSS, into ANSYS Icepak.

Thermal management of radar dome using ANSYS Icepak