Consumer electronics encompasses a wide range of products: smartphones, game consoles, flat-screen TVs, stereos, portable music players, cameras, e-readers and portable telecommunication devices, among many others. Product engineers in this industry must meet the high demand for innovation in both product aesthetic design and functionality. Limitations include reduced power consumption, miniaturization and weight reduction. And in general, the consumer electronics industry is highly competitive with a very short design cycle.
To give a product design its best chance for success, engineering and design teams must accurately predict how complex components will behave in a real-world environment — one that changes continuously and involves the interaction of multiple types of physics. Only multiphysics simulation tools allows users to create virtual prototypes of their designs operating under such real-world conditions, predicting the interactions between structural mechanics, heat transfer, fluid flow and electromagnetics. Furthermore, the best simulation processes go beyond solving problems to developing innovative solutions.
ANSYS provides technology with unparalleled depth and breadth to help organizations shorten the design cycle as well as reduce costs, design uncertainty and the need for extensive testing. The simulation tools are integrated across a wide array of physics.
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On the mechanical front, how do shock and vibration loads, for example, affect a component’s reliability? ANSYS Mechanical software investigates linear and nonlinear mechanical behaviors including thermomechanical stress, modal, harmonic, and fatigue and vibration analysis. For explicit simulation, ANSYS Explicit STR technology offers shock and drop test simulation capabilities integrated with ANSYS Mechanical through the simulation platform, ANSYS Workbench. Simulation tools also address component- and board-level functions as well as modal, harmonic and vibration analysis.
More and more, consumer electronics devices contain powerful electronic components, crammed into tighter-than-ever-before spaces, that must not be allowed to overheat. ANSYS Icepak software enables system-level CFD simulation, including radiation, conduction, and natural and forced convection air cooling for a variety of complex geometries. Joule heating loads in package and PCB substrates can be performed in ANSYS SI/PI products and incorporated into the thermal design analysis.
ANSYS offer solutions for high-speed channel design as well as wireless and antenna design.
In high-speed channel design, HFSS, SIwave and DesignerSI offer comprehensive electromagnetic and circuit simulation tools for signal and power integrity as well electromagnetic interference and compatibility (EMI/EMC) analysis.
For wireless design, the HFSS and DesignerRF products offer integrated electromagnetic, circuit and system simulation capabilities for designing RF components and comprehensive microwave systems. Additionally, engineers use HFSS and Designer RF to conduct full-wave magnetic field intensity studies on various shielding designs. This helps in ensuring compliance with U.S. and E.U. emission regulations.
Digital cameras, laptops, notebook computers, MP3 players, mobile phones, tablets, portable navigation devices, and a host of other consumer electronic products drive this industry's growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves designing for longer battery life, smaller device size and lower cost.
Battery life requirements involve getting the most out of the power that’s available, which requires accurate and consistent power optimization throughout the design flow. ANSYS offers industry-leading solutions for advanced consumer electronic chip design. Subsidiary Apache Design’s PowerArtist, a register transfer language (RTL) power analysis and optimization platform, can identify power improvements early at the RTL level to reduce power consumption without changing system functionality. PowerArtist can quickly identify where power is being consumed and what is needed to reduce it; it also can control changes through a powerful user-friendly interface.
Integrated circuits (ICs) that focus on consuming the lowest amount of power often use circuit design techniques such as multiple voltage domains; furthermore, they are manufactured using advanced process nodes. These factors can result in a higher chance of electrostatic discharge (ESD) failures. PathFinder is a comprehensive layout-based ESD integrity solution targeted to address reliability challenges of nanometer designs. This technology's integrated modeling, extraction and simulation capabilities enable automated and exhaustive analysis of the entire IC, highlighting design weaknesses that are vulnerable to ESD failures.
A comprehensive chip–package–system (CPS) codesign/co-analysis methodology introduces IC awareness into the package design early in the process to help eliminate overdesign and reduce overall system cost. It also introduces package/system awareness into the IC design, allowing designers to perform CPS co-analysis to minimize design failure risks late in the design process. RedHawk is a full-chip power integrity and signoff platform that considers the system environment by including an electrical model of package and board generated by ANSYS extraction software. Chip Power Model (CPM) is a compact and SPICE-accurate model of the full-chip power delivery network (PDN). It provides highly accurate electrical representation of the chip in various operating modes. This data is used by package and board-level power-integrity and signal-integrity analysis solutions, including Sentinel, a complete codesign/co-analysis solution for accurate CPS convergence from early-stage prototyping to signoff.