ANSYS Electronics Simulation Conference - Munich

ANSYS Electronics Simulation Expo - Munich, June 7-8, 2016

Call for Presentations

30-minute presentations are solicited on advances in electronics design and simulation techniques in the following areas

RF and Microwave


Antenna Design, RF & Microwave Components, RADAR, Communication System Design, RF Sensors

chip package system


Signal Integrity, Power Integrity Analysis, EMI/EMC, Printed Circuit Board Analysis, Electronics Cooling



Low-Power IC Design, ESD Analysis, Electromigration

Systems & Sensors


Control Systems, Electric Machine Design, Wireless Power Charging, MEMS

Submit Abstract

January 31 - Abstract Submission    //    February 26 - Notification of Acceptance    //    May 6 - Final Presentations Due


January 31 - Early Bird Deadline

Early Bird Deadline

June 3 - Registration Deadline

Registration Deadline

Early Bird Industry – €320  //  Early Bird Academic - €210  //  Group Ticket (5 persons) €1300  //  More Options On Link Below

Program Highlights

AESE will feature keynotes from industry executives and parallel tracks on technologies that will power the IoT — wireless, sensors, low-power semiconductors and power-electronics/systems.


Dr. Eng. Grzegorz Ombach

Dr. Grzegorz Ombach is the vice president of Engineering at Qualcomm, with responsibility for global research and development of Qualcomm’s Wireless Electric Vehicle Charging (WEVC) technology.
Dr. Ombach joined Qualcomm in April 2012 from Brose Fahrzeugteile, where he managed the design of automotive electric drive systems as Director of Advanced Development Drives and Simulation. Prior to Brose Fahrzeugteile, Dr. Ombach was Principal Expert for Electromagnetic Simulation and Motor Design at Siemens VDO Automotive AG. Dr Ombach’s responsibilities included management of a panel of experts in charge of electric drive systems for automotive at the company.
Dr. Ombach holds a MSc. in Electrical Engineering from the Technical University of Lodz, Poland, and a Ph.D. in Electrical Engineering from the Silesian University of Technology, Poland. Dr. Ombach has authored and coauthored over 70 papers and holds more than 25 patents (awarded and pending) on automotive electrical systems.
VP Engineering QUALCOMM CDMA Technologies GmbH

Why Attend

In only its third year, the AESE has attracted more than 1,000 electronics industry leaders, representing over 200 organizations around the world. The conference presentations are delivered by experts in the fields of power electronics, control systems, semiconductors, chip-package systems, and wireless connectivity. AESE attendees have unique opportunities to meet foremost electronics simulation thought leaders, see how major global companies are using simulation, learn best practices, see the latest technology advances and network with their peers.
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Sponsorship Opportunities

Sponsorship opportunities are currently available. We offer a variety of high-visibility packages to meet your needs.

Learn more

This year the AESE will be co-located with the Automotive Simulation World Congress (ASWC), with all registrants having open access to both conferences. Since electronics are now a major part of vehicles, the co-located ASWC will offer unique cross-learning and networking opportunities to the AESE attendees.



Automotive Simulation World Congress