Dimensions eMagazine

ANSYS Arizona Innovation Conference

October 4, 2017

9:00 AM - 4:30 PM (MST)


ASU SkySong
Building 3
1365 N. Scottsdale Rd.
Scottsdale, AZ 85257

Verly Flores

Today’s engineering teams are challenged to design products in an incredibly complex environment. With the growth of the Internet of Things, products are increasingly a medley of mechanical, electronics and software subsystems with smart functionality. Designing such complex products requires a comprehensive, integrated simulation platform that can handle single and multiple physics simulations efficiently and automatically. ANSYS Platform — the world’s leading simulation environment — is the answer to these challenges.

Join ANSYS for an informative conference on how to incorporate ANSYS Platform and productivity enhancement tools — including digital twins — into your engineering department’s workflow. Presenting customers and ANSYS technical experts will discuss design challenges and how a consolidated simulation platform can help you drive efficiency across your enterprise by providing the bi-directional connectivity characteristic of digital twins.

At the Innovation Conference, you can expect to collaborate, share information and learn how to optimize your use of engineering tools, data, and business processes. 

We look forward to seeing you there.


Time Topic
9:00 - 9:30 AM Registration and Breakfast Reception
9:30 - 9:45  ANSYS Welcome
Andy Bauer, Senior Account Manager, ANSYS
9:45 - 10:30 Keynote: The Role of Simulation and Modeling in the Product Lifecycle Process of ASM
Rudi Wilhelm, Director Global Engineering, ASM 
10:30 - 11:00 Networking Break
11:00 - 11:30 ANSYS Solutions for Additive Manufacturing
Eric Miller, Principal & Co-Founder, PADT
11:30 - 11:45  Is RF Engineering "Black Magic"?
Kevin Kim, Technical Director R&D, NXP Semiconductors
11:45 - 12:00 PM Revolutionizing Cloud Computing with Nimbix
Greg Lewis, Sr. Enterprise Account Executive, Nimbix
12:00 - 1:00 Networking Lunch
1:00 - 1:30 Functional Safety and Model-Based System Engineering
David French, Senior Account Manager, ANSYS
1:30 - 2:00 Using Simulation to Improve Design Cycle
Maryam Khorshidi, CAE Engineer, MTD
2:00 - 2:30 Commercial Antenna Array Work Flow Using ANSYS Electromagnetic Tools
Dave Wittwer, Ph.D., Senior Principal RF Engineer, Galtronics
2:30 - 2:45 ANSYS Ensight Demonstration
Clinton Smith, CFD Team Lead Engineer, PADT
2:45 - 3:00 ANSYS Discovery Live Demonstration
Tyler Smith, Application Engineer, PADT
3:00 - 4:30 Networking Reception, Light Hors D'oeuvres & Cocktails


Rudi Wilhelm

Director Global Engineering, ASM


Rudi Wilhelm joined ASM in 1989 and worked as a process engineer in Japan until 1994. After the assignment in Japan he lead the transformation of the process development team for vertical furnace in Belgium into a corporate R&D center that supports all ASM products and works closely together with IMEC. In 2001 he became the Director of R&D of ASM in Europe leading the product development projects for the Vertical Furnace product line. In 2004 he took on the new role of Director Program Management in Europe. In this role he introduced the stage gate product development and product change process initially in Europe, but later also in the rest of the ASM organization. From 2009 until 2014 he lead the program management team for ALD, EPI and Vertical furnace product lines. Since 2014 he is responsible for the engineering processes and application as used by the engineering teams of ASM across the globe. In this role he also initiated the global agreement ASM currently has with ANSYS.



The Role of Simulation and Modeling in the Product Lifecycle Process of ASM
Rudi Wilhelm, ASM

ASM is a leading supplier of semiconductor process equipment for wafer processing. We’re a truly global company. Based in 14 countries, we benefit from a wider perspective and the advantages of bringing together the best brains in the world to create new breakthroughs. Our broad portfolio of innovative technologies and products are being used right now by the most advanced semiconductor fabrication plants around the world. Helping them to progress along their technology roadmap. Making integrated circuits or chips smaller, faster and more powerful for everyone.

Simulation and modeling are becoming more and more important to reduce time to market and to meet the stringent requirements of the markets we serve.

ANSYS Solutions for Additive Manufacturing
Eric Miller, PADT

Additive manufacturing, rapid prototyping, reverse engineering, and topology optimization increasingly play a vital role in the design of innovative products. We will be discussing how to perform physics-driven free-form design optimization to reduce material waste, minimize weight, while improving product durability and reliability.

Is RF Engineering "Black Magic"?
Kevin Kim, NXP Semiconductors

Wireless communication protocols from Bluetooth to Zigbee connect all our “Smart” devices.  Wireless connectivity is based on RF engineering principles where the traveling signals are propagating electromagnetic waves.  RF engineering is considered “Black Magic” by non-practitioners due to numerous variables involved from electrical to thermal that go into determining the wireless connectivity.  This presentation will focus on an example of an RF amplifier used in cellular systems and show that RF engineering is not a “Black Magic”.  Instead, it is governed by mathematics, physics and circuit principles.  We will demonstrate that these principles can be utilized to precisely simulate the RF performance using Electronic Design Automation software such as ANSYS.

Commercial Antenna Array Work Flow Using ANSYS Electromagnetic Tools
David Wittwer, Ph.D., Glatronics

The design of commercial antenna arrays for cellular networks using ANSYS Electromagnetics tools will presented. An overall workflow will be presented with a recommended tool selection for each phase of the development. Simulations and measurements will be presented for an example array development project.