Thermal Stress Multiphysics

Electronics Thermal Management Using ANSYS Icepak: A Hands-On Workshop

October 4, 2017

11:00 PM - 3:00 PM (EDT)

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Venue:
MicroTek Dulles
12950 Worldgate Drive
Monument II Building, 4th Floor
Herndon, VA 20170
USA

Contact:
Viral Gandhi
viral.gandhi@ansys.com

Thermal management in electronics requires that temperatures of all components be maintained within a safe operating range.  The engineering of thermal performance is no longer limited to a single device and its primary cooling mechanism alone, but often involves many other parts in the system — a neighboring package, a distant fan, or a chassis sheet metal.  In addition, multi-physics coupling considerations are required to fully account for the electro-thermal and thermo-mechanical effects on the design.

ANSYS Icepak is a powerful thermal analysis CFD tool that allows engineers to model complex electronic systems, and perform heat transfer and fluid flow simulations on component-level, board-level or system-level applications.  The ability to import and modify MCAD and ECAD geometry, coupled with extensive multi-physics capabilities, as well as accurate body fitted meshing, make Icepak the tool of choice when sign-off accuracy is required.


In this hands on event, you will hear an overview of ANSYS Icepak and complete two workshops designed to provide a panoramic feel of the ANSYS Icepak workflow.

Seating is limited to 12 students.  Lunch will be served.