Electronics Thermal Management Using ANSYS Icepak

September 19, 2017

10:00 AM - 2:00 PM (CST)


Las Cimas II
807 Las Cimas Parkway
Suite 250
Austin, TX 78746

Anthony Williams

Join ANSYS for this FREE hands-on event highlighting ANSYS Icepak for thermal management in electronics.


Thermal management in electronics requires that temperatures of all components be maintained within a safe operating range.  The engineering of thermal performance is no longer limited to a single device and its primary cooling mechanism alone, but often involves many other parts in the system — a neighboring package, a distant fan, or a chassis sheet metal.  In addition, multi-physics coupling considerations are required to fully account for the electro-thermal and thermo-mechanical effects on the design.

ANSYS Icepak is a powerful thermal analysis CFD tool that allows engineers to model complex electronic systems, and perform heat transfer and fluid flow simulations on component-level, board-level or system-level applications.  The ability to import and modify MCAD and ECAD geometry, coupled with extensive multi-physics capabilities, as well as accurate body fitted meshing, make Icepak the tool of choice when sign-off accuracy is required.

In this hands on event, you will hear an overview of ANSYS Icepak and complete two workshops designed to provide a panoramic feel of the ANSYS Icepak workflow.


Lunch will be served.