ANSYS Icepak

Electronics Thermal Management Using ANSYS Icepak: A Hands-On Workshop

April 25, 2017

11:00 AM - 3:00 PM (PDT)

REGISTER ›

Venue:
ANSYS, Inc.
3240 El Camino Real
Suite 290
Irvine, CA 92602
USA

Contact:
Verly Flores
verly.flores@ansys.com

Thermal management in electronics requires that temperatures of all components be maintained within a safe operating range. The engineering of thermal performance is no longer limited to a single device and its primary cooling mechanism alone, but often involves many other parts in the system — a neighboring package, a distant fan, or a chassis sheet metal. In addition, multi-physics coupling considerations are required to fully account for the electro-thermal and thermo-mechanical effects on the design.

ANSYS Icepak is a powerful thermal analysis CFD tool that allows engineers to model complex electronic systems, and perform heat transfer and fluid flow simulations on component-level, board-level or system-level applications. The ability to import and modify MCAD and ECAD geometry, coupled with extensive multi-physics capabilities, as well as accurate body fitted meshing, make Icepak the tool of choice when sign-off accuracy is required.

Join ANSYS for a free hands-on "Lunch & Learn" workshop for an overview of ANSYS Icepak. This workshop is designed to provide a panoramic feel of the ANSYS Icepak workflow.

Please note that the hands-on session limits registration to 12 attendees.