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ANSYS 18 Innovations - Signal Integrity, Power Integrity, EMI

February 23, 2017

11:00 AM - 12:00 PM (EST)


Online via WebEx


ANSYS 18.0 delivers new key functionalities for high-speed digital design. The powerful new 3-D assembly capability in ANSYS HFSS links ECAD and MCAD with transient circuit simulation and IC models, so you can solve the ‘Connector on Board’ problem within a single design flow using a single mesh. ANSYS SIwave features fast extraction technology, new high-performance computing (HPC) functionality for capacity and speed, and support for PSPICE Voltage Regulator Modules. SIwave also includes enhancements in IBIS-AMI, eye analysis, and state-space fitting within the circuit solver.

Attend this webinar to learn how ANSYS 18.0 has enhanced the Chip-Package-System workflow to address design challenges in power integrity, signal integrity, ESD, thermal and structural challenges. Discover how ANSYS solutions provide a unique virtual prototyping flow to simulate the electrical, thermal, and mechanical behaviors of high-speed electronics, allowing you to meet your system power and performance targets while reducing cost.